Jury awards Qualcomm $31.6M in Apple spat | IC Insights: 300mm fabs to total 121 by year's end | Taiwan's ODMs shifting production to SE Asia countries
Qualcomm CEO Steve Mollenkopf (Mark Wilson/Getty Images)
A jury in a US federal court in San Diego ruled that Apple violated three Qualcomm patents in the iPhone 7, 8 and X and awarded Qualcomm $31.6 million in damages. The fight isn't over, though, since the companies are due back in a San Diego court April 15 in what is expected to be a much more intense face-off over patent licenses and royalties.
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Nine new 300-millimeter wafer fabrication facilities are expected to come on line this year, with five opening in China, IC Insights says. Those new facilities will bring the worldwide total to 121 during 2019, while their ranks will grow to 138 in 2023, per the market research firm.
While the trade tensions between China and the US seem to be lessening, Taiwan-based original design manufacturers and providers of electronics manufacturing services are reportedly still moving some production to plants in Southeast Asia and South Asia to satisfy customer requests, industry sources say. Compal Electronics is ramping up production at its factory in Vinh Phuc Province, northern Vietnam, to make notebook peripherals, while Wistron is initiating volume production of notebook computers at its existing plant in Subic Bay, the Philippines, during the first half of this year.
California, Hawaii and New Mexico are on the path to 100% carbon-free electricity generation, and similar efforts are underway in New Jersey, New York and Washington -- all states with Democratic leadership, Bobby Magill writes. Republican-led states have yet to make such proposals, which shows carbon-free generation is still a partisan issue, says Natural Resources Defense Council senior attorney Noah Long.
Nvidia has brought out the GeForce GTX 1660 graphics card, which has 1,408 CUDA cores, 6 gigabytes of GDDR5 memory operating at 8 gigabits per second, and a boost clock running at 1.8 gigahertz. The GTX 1660 and GTX 1660 Ti models are based on 12th-generation Turing graphics processing unit architecture.
Guard-banding against excessive heat generation is becoming an increasing challenge in chip design, this analysis notes. "We know that the operating temperature of a design is directly dependent on its power consumption, but obtaining accurate power profiles is complex and highly challenging -- especially if there are multiple potential use cases or scenarios," said Lee Wang of Mentor, a Siemens Business.
This faster, more efficient version offers new features targeting automotive applications. JESD209-5 LPDDR5 will eventually operate at an I/O rate of 6400 MT/s, 50% higher than that of the first version of LPDDR4, which will significantly boost memory speed and efficiency for a variety of applications including mobile computing devices such as smartphones, tablets, and ultra-thin notebooks. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, LPDDR5 is available for download from the JEDEC website.
Register today to take advantage of online registration discounts for the ROCS (Reliability of Compound Semiconductors) workshop on Monday, April 29 in Minneapolis, Minn. ROCS will once again be co-located with the CS MANTECH Conference; bringing together researchers, manufacturers and users of compound semiconductor devices. The latest results and new developments in all phases of compound semiconductor reliability will be presented in four sessions.
