Qualcomm, Ericsson complete 5G NR with 3GPP 5G Release 15 | Broadcom CEO talks chip demand, uncertain conditions | Imec teams with NUS for chip-based quantum cryptography tech
September 13, 2019
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Qualcomm, Ericsson complete 5G NR with 3GPP 5G Release 15
Qualcomm and Ericsson were able to complete a 5G New Radio data connection complying with the worldwide 3GPP 5G NR Release 15 specifications, the companies say. This connection was made in the standalone mode of operation, they note.
Electronics Weekly (UK) (9/13) 
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ICs, Memory & More
Broadcom CEO talks chip demand, uncertain conditions
Broadcom CEO Hock Tan told analysts, "There is not much clarity or visibility yet, or certainty that any sharp recovery is around the corner," as the chip company reported results from its fiscal third quarter ended Aug. 4. Kinngai Chan of Summit Insights Group believes it is appropriate for "Broadcom to provide a cautious outlook at this juncture due to the uncertainty caused by the trade friction."
ZDNet (9/12),  Reuters (9/12) 
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Imec teams with NUS for chip-based quantum cryptography tech
Imec will work with the National University of Singapore on developing chip-based prototypes for secure quantum communication networks under a five-year program. The research team will consider quantum cryptography and post-quantum cryptography approaches.
New Electronics (9/13) 
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Going Green
Team crafts lithium battery design without cobalt, nickel
Georgia Institute of Technology researchers came up with a lithium-based battery design that doesn't require the use of cobalt and nickel, which are expensive metals. The team paired an electrode of transition metal fluorides with a solid polymer electrolyte.
Machine Design (9/12) 
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Semiconductors in Action
Socionext debuts dual-channel, multi-standard TV demodulator
Socionext introduced the SC1502AF-02 dual-channel demodulator for digital televisions, complying with a variety of standards. Volume shipments of the microchip, which measures 7 millimeters by 7mm, are scheduled for December.
Electronics Weekly (UK) (9/13) 
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Testing & Standards
Power delivery networks get complicated with 3DICs
With more chip designs embracing the 3DIC packaging technologies, including chiplets, working with the power delivery network is growing ever more complicated, this analysis notes. Jerry Zhao of Cadence Design Systems says, "The challenge is how will the power delivery network (PDN) provide enough effective voltage supply to every instance so that my function will not change and my timing will not change."
Semiconductor Engineering (9/12) 
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JEDEC News
Don't miss this unique opportunity: DDR5, LPDDR5 & NVDIMM-P Workshops
Join us for the JEDEC DDR5, LPDDR5 and NVDIMM-P Workshops and Memory Tutorial in Santa Clara, Calif., Oct. 7-10, 2019 and learn directly from experts who were key to the development of these standards. The companion Memory Tutorial class will provide an essential prerequisite for prospective DDR5 Workshop attendees who do not have significant experience with DDR4 memory technology. Register today! Don't delay -- registration ends 9/27 or when available space is filled!
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