SK Hynix plans to start volume production of DDR DRAMs this year, enabling the introduction of DDR5-8400 modules in the near future. SK Hynix's Sungsoo Ryu says, "In the 4th Industrial Revolution, which is represented by 5G, autonomous vehicle, AI, augmented reality, virtual reality, big data and other applications, DDR5 DRAM can be utilized for next-gen high performance computing and AI-based data analysis."
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Samsung Electronics is expected to report $44.9 billion in sales for the first quarter, an increase of 5.5% year-over-year, while the Q1 operating profit will be down 0.09% compared with last year, analysts predict. Meanwhile, Samsung suspended production at its home appliance factory in Newberry County, S.C., after two employees tested positive for coronavirus; following cleaning and disinfection, production is expected to resume on Monday.
The UK's Royal Society wants to see digital technologies used in the pursuit of "net zero" carbon emissions around the world. Artificial intelligence and machine learning could be used toward this goal, says the Royal Society's Andy Hopper, who also serves as a professor of computer technology at Cambridge University.
Murata Manufacturing worked with Google to produce the Coral Accelerator Module, an artificial intelligence module in a very small form factor. The module is paired with the Google Edge TPU, a custom application-specific integrated circuit for AI applications at the network edge.
NXP Semiconductors and Microsoft are collaborating on wider adoption of the Azure RTOS, a real-time operating system that works with NXP's microcontrollers. The companies enable the use of Azure RTOS within NXP's MCUXpresso software development kit.
Achieving system-level security requires more than the incorporation of a secure processor in a system-on-a-chip device, this analysis notes. The writers tout the use of Tortuga Logic's Radix-S security verification platform with Synopsys' DesignWare ARC Processor intellectual property.
JEDEC has published UFS version 3.1: JESD220E. An optional new companion standard, JESD220-3: UFS Host Performance Booster (HPB) Extension, is also available. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 3.1 introduces new features intended to help maximize device performance while minimizing power usage. Both JESD220E and JESD220-3 are available for download from the JEDEC website.