Micron announced a plan to take full control of its IM Flash Technologies joint venture with Intel and make it a wholly owned subsidiary. Micron will pay $1.5 billion to Intel as well as take on Intel's nearly $1 billion debt to the joint venture.
System-in-package technology and other advanced IC packaging are available for applications in artificial intelligence, the internet of things and smart sensors, notes SC Hung of ASE Technology Holding. The chip assembly and testing contractor has completed 85 packaging research and development projects collaborating with Taiwan's National Cheng Kung University and National Sun Yat-sen University in the past six years.
Researchers at the University of California at Santa Cruz and Lawrence Livermore National Laboratory used a 3D printer to make a microscopic scaffold with porous graphene, filled with a pseudocapacitive aerogel, a capacitor material that can function like a battery. The resulting capacitors are said to provide a record-breaking amount of charge over a surface area.
Renesas Electronics brought out a software development kit for its R-Car automotive system-on-a-chip devices, enabling developers to pair dynamic vehicle data with cloud-based data in real time. The software development tools use the public cloud of Amazon Web Services with AWS Greengrass and AWS IoT Core.
Western Digital debuted the iNAND EU321 embedded flash drive for smartphones, featuring its 96-layer 3D NAND flash memories. The new EFD boasts a UFS 2.1 interface and is available in data-storage capacities ranging from 32 gigabytes to 256GB.
Innodisk is teaming with Super Micro Computer and others to develop industrial storage products with artificial intelligence and internet of things technology for applications in smart cities and smart streets. The Taiwanese vendor of industrial embedded flash memories and DRAMs is looking toward the market for such applications in China.
For each memory module family developed by JEDEC's JC-45 Committee, both a Design Standard and one or more related Memory Module Design File Registrations (sometimes referred to as Gerber Files) have been developed. The Design Standards provide detailed information regarding the module design details, as developed and characterized by various JEDEC member companies. These reference files are registered as industry accepted examples for use by manufacturers. Please be sure to read the license agreement prior to purchasing a design file. New Memory Module Design File Registrations are now available for non-members to purchase from the JEDEC website (download is free for JEDEC members), including DDR4 288-pin Unbuffered DIMMs and DDR4 260-pin Unbuffered SODIMMs.