October 28, 2021
JEDEC SmartBrief
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Today's Tech Buzz
GloFlo prices IPO at $47 a share, raising $2.6B
(Matthias Rietschel/Getty Images)
GlobalFoundries priced its Nasdaq initial public offering at $47 per share, which will yield around $2.6 billion for the chipmaker owned by Mubadala Investment, Abu Dhabi's sovereign wealth fund. Mubadala sold 22 million shares in the IPO, yielding more than $1 billion to the fund, which acquired the wafer fabrication facilities of Advanced Micro Devices in 2009.
Full Story: Reuters (10/27) 
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ICs, Memory & More
Samsung Electronics reported a net profit of $10.5 billion for the third quarter, buoyed by robust demand for memory chips and increased revenue from the company's silicon foundry business. "The overall price situation remained favorable and the company set a new record for quarterly bit shipments and the second-highest revenue for DRAM, backed in particular by significant growth in server sales," Samsung said in a statement.
Full Story: Yonhap News Agency (South Korea) (10/28) 
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Going Green
Apple joined the Sustainable Semiconductor Technologies and Systems research program, headed up by Imec, the Belgium-based research and development organization. Meanwhile, Apple reports 175 suppliers are committing to using clean power sources, aiming at bringing more than 9 gigawatts of clean energy into power grids.
Full Story: VentureBeat (10/28),  Reuters (10/27) 
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Semiconductors in Action
Intel brought out the flagship Core i9-12900K CPU, aimed at gaming applications -- the first chip in the company's "Alder Lake" processor line. The chipmaker continues to build the Aurora supercomputing system for the Argonne National Laboratory, and Intel is teaming with Google to develop the "Mount Evans" application-specific integrated circuit, an infrastructure processing unit, which will be used in Google Cloud's data centers.
Full Story: The Verge (10/27),  VentureBeat (10/27),  AnandTech (10/27) 
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Analog Devices introduced the ADA4355 current-input/digital-output converter for optical reflectometry applications, paired with photo diodes to make time-of-flight measurements in 10 nanoseconds. The device is a hybrid module, contained in a 12-millimeter b 6mm ball grid array package.
Full Story: Electronics Weekly (UK) (10/27) 
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Testing & Standards
System complexity is causing semiconductor technologists to resort to "System Moore/SysMoore" and "More than Moore" approaches to system-on-a-chip device designs, this analysis notes. "Rather than building more systems on a single chip, or SoC, we will see several chips integrated into the system of chips, which will maintain exponential growth of doubling the productivity every year," says Robert Li of Synopsys Taiwan.
Full Story: DigiTimes (10/28) 
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JEP95 is a compilation of over 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase in addition to the downloads available on the JEDEC website. Recent updates include Microelectronic Outlines MO-347A, MO-348A and Carrier Outline CO-036A. Visit the JEP95 webpage for a full list.
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