IC Insights: 1 trillion devices to ship in 2020 | Yole: Emerging memory types to surge in the near future | Sources: Health care applications to drive MCU demand
Worldwide shipments of semiconductors and other devices will increase 7% this year, exceeding 1 trillion units for the second time in the industry's history, IC Insights forecasts. The first time global device shipments hit 1 trillion was in 2018, the market research firm notes.
Magnetoresistive random-access memories, phase-change memories and other nonvolatile memories will see a compound annual growth rate of 118% during the next five years, Yoke Developpement predicts. "The stand-alone emerging NVM market will grow to over $4 billion in 2025," says Yole's Simone Bertolazzi.
Nexperia is collaborating with Ricardo, an automotive engineering consultancy, on developing an electric vehicle inverter using gallium nitride chips. GaN technology is an alternative to silicon-based insulated-gate bipolar transistors and silicon carbide devices, Nexperia notes.
Unisoc brought out the T7520 system-on-a-chip device for 5G applications. The smartphone chip is made with a 6-nanometer process incorporating extreme ultraviolet lithography technology.
Dialog Semiconductor introduced the CCE4503 networking chip with IO-Link communications capabilities. The chip is meant to work with sensors and other devices on wired industrial networks.
Developing chips for inferencing tasks in artificial intelligence applications is proving to be a challenge, this analysis notes. "Power is always critical, and there is only so much dissipation you can afford," says Megha Daga of Cadence Design Systems.
Add your name to the interest list for updates on the 2020 ROCS (Reliability of Compound Semiconductors) Workshop to be held on Monday, May 11, 2020 in Tucson, Ariz. ROCS will once again be co-located with the CS MANTECH Conference; bringing together researchers, manufacturers and users of compound semiconductor devices. The latest results and new developments in all phases of compound semiconductor reliability will be presented in four sessions.
