In a move that could strengthen its offerings in high-performance computing, Intel has agreed to acquire interconnect technology and related intellectual property from Cray for $140 million in cash. Up to 74 Cray employees would join Intel's workforce under the deal, which is expected to close in this quarter. Earlier this year, the chipmaker bought the InfiniBand networking assets of QLogic for $125 million and hired some QLogic employees.
The bankruptcy filing by Elpida Memory two months ago has had a negative effect on the prices of stock in Micron Technology and SK Hynix, according to this analysis. Samsung Electronics, which hasn't shown any interest in acquiring Elpida's assets, has seen its stock price inch up slightly since Hynix reported that it made a bid for Elpida, the analysis notes.
LeCroy and Agilent Technologies are doing battle in the high-end oscilloscopes arena, leapfrogging each other this year in claiming the highest bandwidth available. LeCroy started off the year by unveiling its LabMaster 10Zi scope, capable of measurements up to 60 GHz. Agilent answered this month with the Infiniium 63 GHz 90000Q series, which goes up to 63 GHz. LeCroy has tweaked its LabMaster 10Zi, pushing the scope up to 65 GHz -- putting the company back on top in the bandwidth race.
ARM Holdings reported its net income for the first quarter rose from a year ago to $60.3 million, while revenues were up 14% to $213.3 million. Strong sales of iPhones and iPads, which contain ARM-based processors, in the quarter helped push up Q1 shipments of chips based on ARM designs to 1.9 billion, up nearly 3% from 1.85 billion chips a year earlier.
Focus on Human Nature to Respond More Effectively During a Breach The most thorough preparation pre-breach won't matter if your response team is derailed by emotions like denial, tunnel-vision, and anger during the response. Download this whitepaper to learn which emotions are most likely to derail your team and steps to take now to be ready to address them in a crisis. Download whitepaper >
Under the Focus Center Research Program, chipmakers and the Defense Advanced Research Projects Agency are looking to attract university researchers to help them develop a faster generation of semiconductors. The program seeks to employ nanotechnology and quantum engineering in the effort.
Microchip Technology has introduced the MCP3911, which brings together a pair of 24-bit analog-to-digital converters. The chip, now in volume production, offers more accurate measurements from start-up to maximum current, according to the company, and is meant for use in smart meters and other power-monitoring systems.
Huawei Technologies, which has developed its own ARM-based, quad-core processor for its smartphones, might sell chipsets for mobile electronics, an executive of the company hinted. "If we cannot make money from smartphones, we can still make money from the chipset offerings," said Executive Vice President Eric Xu. "If we can make money from every smartphone chip, then it will be substantial."
Broadcom has introduced the BCM88030 Ethernet network processor, a chip made with 40-nanometer features. With 64 packet-processing cores, the IC can handle up to 12 10-gigabit channels at a time, according to the company.
Advanced Micro Devices is shipping its new ATI Radeon HD 7000M-series graphics processing units, which are designed for use in notebook computers. The "Chelsea," "Heathrow" and "Wimbledon" chips are made with a 28-nanometer process.
Algotochip has unveiled a service that derives algorithms from C programming code and can deliver a system-on-a-chip design ready for fabrication in eight to 16 weeks. The startup says it has six customers, one of which is said to be able to turn around a Long Term Evolution chip in 12 weeks.
Member company Samsung offers a closer look at JEDEC's upcoming Mobile Forum
Read Samsung's blog post for more information about the event and plans for their keynote presentation on May 10 in Santa Clara, Calif., including a look at solid state drives and Green DDR3 in IT infrastructure and mobile environments, as well as new mobile solutions including LPDDR3. Space is limited -- register today!
JEDEC publishes several new registered outlines in JEP95; available for free download
JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all. Visit the JEDEC website for more information and free download. An annual updating service for JEP95 is available by paid subscription, and a complete hard copy is also available for order.