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April 27, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Samsung weighs converting fab lines from memories to logic chips
    Samsung Electronics is considering changing more of its wafer fabrication lines from production of memory devices to logic ICs in order to meet increasing demand for processors going into smartphones and tablet computers. One line has already been changed over from memories to system chips, with volume production scheduled for this quarter. Reuters (4/27) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • TSMC to boost capex by 42% this year, expanding 28nm capacity
    Taiwan Semiconductor Manufacturing said it would increase its capital expenditure budget for 2012 to $8.5 billion from the previous projection of $6 billion, with more than half of that new spending being devoted to expanding its production capacity for semiconductors made with 28-nanometer features. The world's largest silicon foundry also will use part of the 42% boost in capital spending to begin preparing for production of 20nm chips, scheduled for early 2014. The Wall Street Journal (4/26), DigiTimes (4/27) LinkedInFacebookTwitterEmail this Story
  • GlobalFoundries to fabricate 2.5D/3D chips
    GlobalFoundries reports that it is preparing to make three-dimensional devices with 20-nanometer features at its Fab 8 facility in Saratoga County, N.Y. The silicon foundry also is readying production of interposers for 2.5D chips in Singapore. Volume production of 3DICs is not expected until 2014. (4/26) LinkedInFacebookTwitterEmail this Story
  • Winbond to change production of specialty DRAM, NOR flash memory
    Winbond Electronics told investors Wednesday it would shift production of its specialty DRAMs to a 46-nanometer process and fabrication of its NOR flash memory devices to a 58nm process. The company plans to increase capacity for making NOR flash from 15,000 wafers a month to 17,000, while decreasing specialty DRAM capacity to 18,000 wafers a month from 20,000. DigiTimes (4/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • USC researchers develop method for printing solar cells
    Researchers at the University of Southern California's Dornsife College of Letters, Arts and Sciences have developed cadmium selenide nanocrystals that could be used in printing solar cells. The scientists came up with a synthetic ligand to stabilize the nanocrystals, which measure about 4 nanometers across, without insulating them, enabling the material to be formed into films of cadmium selenide thiocyanate. Electronics Weekly (U.K.) (4/27) LinkedInFacebookTwitterEmail this Story
  • Nvidia works with TSMC to increase energy efficiency of Kepler chips
    Nvidia and its silicon foundry, Taiwan Semiconductor Manufacturing, closely collaborated on development of the Kepler-architecture graphics processing unit to make those chips more energy-efficient than its predecessors, according to this blog post. The partners previously had a more traditional customer-supplier relationship, carefully separating their duties in designing and manufacturing chips. (4/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  Testing & Standards 
  • Pentagon designates N.Y. fab as "trusted foundry"
    The Defense Microelectronics Agency of the Department of Defense has accredited the College of Nanoscale Science and Engineering's Smart System Technology and Commercialization Center of Excellence in Canandaigua, N.Y., as a "trusted foundry," meaning it is secure enough to produce chips for intelligence agencies and military organizations. In addition to U.S. government agencies, the facility will be able to serve allied foreign governments and government contractors. EE Times (4/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • JEDEC member companies recognized in CR's 100 Best Corporate Citizens 2012
    JEDEC congratulates its member companies who were lauded by CR Magazine in its annual 100 Best Corporate Citizens report. IBM, Intel and Microsoft took three of the top 5 spots on the list; and Texas Instruments, Hewlett-Packard, Dell, Cisco Systems, Lexmark International and Oracle were also recognized. Read more about the report. LinkedInFacebookTwitterEmail this Story
  • Samsung, Nokia and Micron to keynote JEDEC's Mobile Forum on May 10 in Santa Clara, Calif.
    JEDEC's Mobile Forum offers all the insight you need to make an impact on your next design: the latest in memory technology for mobile devices such as smartphones, ultra-thin notebooks and tablets. See the agenda and register online -- space is limited! LinkedInFacebookTwitterEmail this Story
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Ideas are like rabbits. You get a couple and learn how to handle them, and pretty soon you have a dozen."
--John Steinbeck,
American writer

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