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December 6, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • AMD has no BGA-only packaging plans for its processors
    Advanced Micro Devices said it will continue to support do-it-yourself and enthusiast users by keeping the same sockets for its processors in 2013 and 2014. The statement comes in response to unconfirmed reports that Intel is considering putting its desktop processors into ball-grid array packaging. "We have no plans at this time to move to BGA-only packaging and look forward to continuing to support this critical segment of the market," AMD's Gary Silcott said. (12/5) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • IHS iSuppli: Sony, Toshiba to spend more on ICs in 2013
    In 2013 Sony will purchase $8.4 billion worth of semiconductors, up 5% from 2012's $8 billion IC budget, and Toshiba will raise its chip purchasing by 2% to $6.1 billion, according to estimates from IHS iSuppli. The increased spending comes as several Japanese electronics giants are in financial straits. Electronics Weekly (U.K.) (12/6) LinkedInFacebookTwitterEmail this Story
  • Nantero raises $10M+ to advance NRAM development
    Nantero has raised more than $10 million in its latest round of funding to continue development of its NRAM technology, random-access memory chips based on carbon nanotubes. Investors include Charles River Ventures. Nantero has been able to fabricate 4-megabit arrays with complementary metal-oxide semiconductor processes, it says. The Register (U.K.) (12/5) LinkedInFacebookTwitterEmail this Story
  • Foundries crank up 28nm IC production for Qualcomm
    GlobalFoundries, Samsung Electronics and Taiwan Semiconductor Manufacturing have all increased their production capacity for 28-nanometer chips designed by Qualcomm, easing the shortage of the company's smartphone processors seen earlier this year, according to this article. "We did have a situation where I don't think our fab partners were quite ready for the fact we had some incredible demand. We believe we're going to be out of the supply situation by the end of this year," Qualcomm Chief Operating Officer Steven Mollenkopf told Bloomberg. Bloomberg (12/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  Semiconductors in Action 
  • Intel will stay with LGA packaging for now
    Intel said it has no immediate plans to change from putting its processors in land-grid array packages to ball-grid array packages, which could inhibit some users swapping out processors from motherboards. "Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the enthusiast DIY market," Intel spokesman Daniel Snyder said. (12/5) LinkedInFacebookTwitterEmail this Story
  • European researchers put an LCD in a contact lens
    Imec researchers have been able to embed a liquid-crystal display within a contact lens, creating the potential for cosmetic and medical applications. The LCD-based lenses could protect parts of the eye from damage by sunlight, it was said, or they could be used to change the color of the iris. Electronics Weekly (U.K.) (12/5) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • How ATE can identify counterfeit chips for military applications
    Automatic test equipment can be used to run electrical tests on military-standard chips, weeding out the counterfeit parts, writes Joseph Federico of NJMET. Chip testers can also resort to using instrumentation boards or instrumentation interfaces to perform functional and parametric tests on such parts, he notes. EE Times (12/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • JEDEC memberships for 2013 now available -- join today
    As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: From components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today. LinkedInFacebookTwitterEmail this Story
  • EE Times takes a first look at JESD230 NAND Flash interface interoperability standard
    JEDEC and ONFI talk with EE Times Memory Designline editor Kristin Lewotsky in this informative Q-and-A about JESD230. The standard is available for free download from both and LinkedInFacebookTwitterEmail this Story
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American psychologist and philosopher

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