| News for and about the microelectronics industry |  |
| Today's Tech Buzz |  |  |
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- Why would Apple want to drop Intel processors?
 Apple's prowess in designing processors for its mobile devices will likely give Apple the capability to drop Intel as the supplier of the processors for its Mac line, according to Nathan Brookwood of Insight 64. "I think in this ultimate battle -- in the tablet and smartphone area but also MacBooks -- it's not so much the power and the architecture, it's the flexibility that folks, who have the volume to justify custom designs, get by doing their own," he says in this interview. CNET
(11/11)     
| ICs, Memory & More | | |
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- Report: Samsung gets 20% increase for making Apple processors
Apple has reportedly agreed to paying almost 20% more for the application processors Samsung Electronics makes for its mobile devices, according to Chosun Ilbo. Samsung fabricates the A-Series processors custom-designed by Apple for the iPad, iPhone and iPod, and it is refitting its plant in Austin, Texas, to make more logic devices, reportedly for Apple. The Verge
(11/12)
- MEMS market to grow with increasing applications, analysts say
The use of microelectromechanical system devices in smartphones is projected to increase 26% per year through the next four years, according to Stephan Ohr of Gartner, but even greater growth is possible for other, emerging MEMS applications. Jean-Christophe Eloy of Yole Developpement said these new applications include micromirrors for embedded pico projectors, microspeakers and oscillators. DigiTimes
(11/12)
| Going Green | | |
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| Semiconductors in Action | | |
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- Xsens, ST to show off MEMS-based wearable 3D motion tracker
Xsens and STMicroelectronics have developed a wearable wireless 3D body motion tracking system that will be demonstrated this week in Munich, Germany. The demonstration unit is based on ST's iNEMO-M1, which pairs an STM32 microprocessor with the iNEMO motion sensors using microelectromechanical system technology. EE Times Europe
(11/9)
- Cray touts faster approach for supercomputers
Cray says its upcoming supercomputers will feature an interconnect called Aries and a new routing approach, with both aimed at a speed boost for internal operations. "The rate that data needs to move in and out of the node has gone up, and the network must be able to sustain that," Cray's Barry Bolding says. ITWorld.com/IDG News Service
(11/8)
| Testing & Standards | | |
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- IEEE gives the go-ahead for 1149.1-2012 JTAG standard
Balloting by the Institute of Electrical and Electronics Engineers has resulted in the approval of the IEEE 1149.1-2012 JTAG standard, which was crafted to simplify semiconductor testing. "There were a number of critical decisions the working group made that resulted in a robust standard that will drastically reduce test-related engineering while enhancing IC and system test capabilities," said CJ Clark, chair of IEEE 1149.1 and CEO of Intellitech. EE Times India (free registration)
(11/12)
| JEDEC News | | |
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JEDEC and ONFI publish NAND flash interface interoperability standard
JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both www.jedec.org and www.onfi.org.
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Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G.
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