Reading this on a mobile device? Try our optimized mobile version here:

November 12, 2012
Sign upForwardArchiveAdvertise
News for and about the microelectronics industry

  Today's Tech Buzz 
  • Why would Apple want to drop Intel processors?
    Apple's prowess in designing processors for its mobile devices will likely give Apple the capability to drop Intel as the supplier of the processors for its Mac line, according to Nathan Brookwood of Insight 64. "I think in this ultimate battle -- in the tablet and smartphone area but also MacBooks -- it's not so much the power and the architecture, it's the flexibility that folks, who have the volume to justify custom designs, get by doing their own," he says in this interview. CNET (11/11) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Report: Samsung gets 20% increase for making Apple processors
    Apple has reportedly agreed to paying almost 20% more for the application processors Samsung Electronics makes for its mobile devices, according to Chosun Ilbo. Samsung fabricates the A-Series processors custom-designed by Apple for the iPad, iPhone and iPod, and it is refitting its plant in Austin, Texas, to make more logic devices, reportedly for Apple. The Verge (11/12) LinkedInFacebookTwitterEmail this Story
  • MEMS market to grow with increasing applications, analysts say
    The use of microelectromechanical system devices in smartphones is projected to increase 26% per year through the next four years, according to Stephan Ohr of Gartner, but even greater growth is possible for other, emerging MEMS applications. Jean-Christophe Eloy of Yole Developpement said these new applications include micromirrors for embedded pico projectors, microspeakers and oscillators. DigiTimes (11/12) LinkedInFacebookTwitterEmail this Story
  • Intel ships processors for servers, supercomputers
    Shipments of Intel's Xeon Phi processors, code-named Knights Corner, have begun, with each chip containing 60 or more cores, according to the company. Meant to be used in servers and supercomputers, the processors can operate at a teraflop per second or higher, part of a program to develop chips for an exaflop supercomputer within six years. News Service (11/12), The Register (U.K.) (11/12) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • U.K. firm develops low-power spectrum analyzer board
    RHDC Services has developed a small audio spectrum analyzer with a Texas Instruments MSP430 microcontroller that is powered by a coin-cell battery. "We created the FFTD1A development board as a prototyping platform for ultra-low-power designs," said Robert Hancox, the firm's founder. Electronics Weekly (U.K.) (11/9) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Xsens, ST to show off MEMS-based wearable 3D motion tracker
    Xsens and STMicroelectronics have developed a wearable wireless 3D body motion tracking system that will be demonstrated this week in Munich, Germany. The demonstration unit is based on ST's iNEMO-M1, which pairs an STM32 microprocessor with the iNEMO motion sensors using microelectromechanical system technology. EE Times Europe (11/9) LinkedInFacebookTwitterEmail this Story
  • Cray touts faster approach for supercomputers
    Cray says its upcoming supercomputers will feature an interconnect called Aries and a new routing approach, with both aimed at a speed boost for internal operations. "The rate that data needs to move in and out of the node has gone up, and the network must be able to sustain that," Cray's Barry Bolding says. News Service (11/8) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • IEEE gives the go-ahead for 1149.1-2012 JTAG standard
    Balloting by the Institute of Electrical and Electronics Engineers has resulted in the approval of the IEEE 1149.1-2012 JTAG standard, which was crafted to simplify semiconductor testing. "There were a number of critical decisions the working group made that resulted in a robust standard that will drastically reduce test-related engineering while enhancing IC and system test capabilities," said CJ Clark, chair of IEEE 1149.1 and CEO of Intellitech. EE Times India (free registration) (11/12) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • JEDEC and ONFI publish NAND flash interface interoperability standard
    JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both and LinkedInFacebookTwitterEmail this Story
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

I observe the physician with the same diligence as the disease."
--John Donne,
British poet, satirist, lawyer and cleric

LinkedInFacebookTwitterEmail this Story

Subscriber Tools
Print friendly format | Web version | Search past news | Archive | Privacy policy

Account Director:  Roger Leek (804) 803-1414
A powerful website for SmartBrief readers including:
 Recent JEDEC SmartBrief Issues:   Lead Editor:  Susan Rush
Contributing Editor:  Jeff Dorsch
Mailing Address:
SmartBrief, Inc.®, 555 11th ST NW, Suite 600, Washington, DC 20004
© 1999-2012 SmartBrief, Inc.® Legal Information