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March 21, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Analysis: Which lithography tech will prevail for 10nm, 7nm chips?
    Some technologists have given up on using extreme ultraviolet or maskless multibeam electron-beam lithography for making logic chips with 10-nanometer features, Mark LaPedus writes. For the 7nm process node, the jury is still out on whether those two once-promising technologies will contend, with directed self-assembly and the reliable standby, 193nm immersion lithography with multiple patterning, in the running, he writes. (3/21) LinkedInFacebookTwitterEmail this Story
Breakthru DDR/LPDDR analysis for both controllers & ICs
New Memory Compliance Analyzer integrates realtime protocol analysis with logic analysis to realize a breakthrough instrument for DDR and LPDDR memory systems. The innovative dual-instrument combination enables memory controller performance monitoring as well as state of the art real-time DDR and LPDDR protocol violation detection. Learn more here.
  ICs, Memory & More 
  • EU reportedly will allege price fixing in smart-card chips
    The European Commission may bring an antitrust case alleging price fixing by manufacturers of chips used in smart cards, Bloomberg reports, citing three people familiar with the probe. The EU investigation, which dates back to 2008, has involved Atmel, Infineon Technologies, NXP Semiconductors, Renesas Technology and STMicroelectronics. Bloomberg (3/20) LinkedInFacebookTwitterEmail this Story
  • The foundry field for 28nm devices gets more crowded, TSMC finds
    More silicon foundries are now able to make semiconductors with 28-nanometer features, which could threaten the dominance of Taiwan Semiconductor Manufacturing in that market, sources say. The Sankei Shimbun newspaper reports that Panasonic may divest its mobile phone business and identifies HTC and TSMC as potential buyers. It appears unlikely that TSMC would want to enter the mobile phone business, DigiTimes reports. DigiTimes (3/21), DigiTimes (3/20) LinkedInFacebookTwitterEmail this Story
  • ABI: Broadcom leapfrogs MediaTek with tiny multimode transceiver
    Broadcom's new BCM2093 chip may outsell MediaTek's MT6167 in the market for multimode transceivers going into low-end smartphones, according to ABI Research. "It is rare to see two such significant products hit production at virtually the same time, but the competition in the low-cost smartphone market is driving cost down and speeding cost-saving technologies to production," said ABI's Jim Mielke. EE Times Asia (free registration) (3/21) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Other News
  Semiconductors in Action 
  • Huawei and ZTE will use MediaTek's quad-core processors, sources say
    Huawei Technologies and ZTE are reportedly implementing MediaTek's quad-core MT6589 processors for use in high-end smartphones to be marketed in China, DigiTimes reports, citing industry sources. Those two handset manufacturers will bring out phones with the MediaTek chips in the second half of this year, the sources say. DigiTimes (3/20) LinkedInFacebookTwitterEmail this Story
  • Fujitsu touts 16-core CPU for high-reliability needs
    Fujitsu says it has designed a 16-core Sparc64 processor for mission-critical servers. "Sparc64 X inherits error correction in its SRAM and a hardware instruction retry mechanism with parity on most of flip-flops to enable execution to continue after a single bit upset," a company statement says. Electronics Weekly (U.K.) (3/20) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Intel's "Haswell" chips will be faster, but might not reach many PCs
    The Tom's Hardware website benchmarked a pre-production "Haswell" processor from Intel and found that it runs faster than previous Core microprocessors, Brooke Crothers notes in this blog post. The "Haswell" fourth-generation Core processors are more likely to show up in tablet computers or laptop/tablet hybrids than in desktop PCs running on Windows 8, he writes. CNET (3/20) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Last chance to save: early bird rates end 3/22 for JEDEC's Mobile Forum 2013
    Save $50 over onsite rates when you register online by 3/22. Join us in Santa Clara, Calif., on 5/1 & 5/2 where industry leaders will focus on the latest developments and standards for mobile, including UFS, LPDDR3 & 4 and Wide I/O 2. Visit the JEDEC website for the complete agenda and registration. LinkedInFacebookTwitterEmail this Story
  • JEDEC welcomes new members to the Association
    JEDEC is the global leader in developing standards for the microelectronics industry, bringing together over 4,000 member company volunteers in 50 technical committees to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to the following new member companies: Compeq Manufacturing, Global Unichip Corporation, Mayo Clinic SPPDG Dept., National Instruments, Smart Storage Systems and SmartDV Technologies India. Interested in JEDEC membership for your company? Find out more and join today. LinkedInFacebookTwitterEmail this Story
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--Henrik Ibsen,
Norwegian playwright

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