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November 28, 2012

News for and about the microelectronics industry

Today's Tech Buzz

WSTS: Chip sales down 3.2% this year, up 4.5% in 2013
While global semiconductor sales are estimated to decline by 3.2% this year to $290 billion, they are poised to increase 4.5% next year to $303 billion, according to World Semiconductor Trade Statistics. DigiTimes (11/28)

ICs, Memory & More

Memristors could be alternative to server CPUs, HP Labs says
HP Labs, the research arm of Hewlett-Packard, is developing memristors that could one day succeed server processors, this article notes. These advanced chips could be combined with logic elements to form "nanostores," a technology that is three to five years in the future, according to HP Labs. EE Times (11/28)

Can TSMC increase capacity enough to keep Apple happy?
Taiwan Semiconductor Manufacturing is likely to start fabricating custom processors for Apple's mobile devices next year, taking over that role from Samsung Electronics, DigiTimes reports, citing industry observers. This prospect has some in the industry wondering whether the foundry will have enough production capacity to satisfy Apple and continue making chips for its long-standing customers, such as Altera, Nvidia and Qualcomm. DigiTimes (11/28)

ADI profit off by 2.4% in Q4; annual sales down nearly 10%
Analog Devices reported net income in its fiscal fourth quarter declined by 2.4% from a year earlier. Revenue was up 2% to $695 million. The company forecasts revenue in the fiscal first quarter to decline by 6% to 12%. The Wall Street Journal/Dow Jones Newswires (11/27)

Going Green

Toshiba constructs R&D center for renewable energy
Toshiba is putting up a facility in Yokohama, Japan, that will be devoted to research and development in renewable energy, including hydro and thermal power. The building is scheduled for completion in early 2014 and will house 1,500 engineers, the company said. Electronics Weekly (U.K.) (11/27)

Semiconductors in Action

Penn researchers develop method for making flexible electronics
Researchers at the University of Pennsylvania are coating flexible plastic sheets with cadmium selenide, creating the possibility for faster electronics in flexible form. "[T]hese cadmium selenide nanocrystal devices can move electrons 22 times faster than in amorphous silicon," professor Cherie Kagan said. EE Times (11/28)

BitMicro debuts new SSD architecture
The new Talino architecture from BitMicro is meant for enterprise-class solid-state drives and will be used in the maxIO line of I/O accelerators and SSDs, according to the company. The architecture incorporates a quad-core processor with embedded cores and a multi-bus design. XBitLabs.com (11/27)

Testing & Standards

CamSemi offers flyback controller for USB chargers
CamSemi has introduced the C5183 flyback controller chip, meant to be used in USB charging of smartphones. The company is sampling the chips for prospective customers. "A number of lead customers are finalizing their first C5183 designs and CamSemi expects them to move into production very soon," CamSemi CEO David Baillie said. Electronics Weekly (U.K.) (11/28)

JEDEC News

Now is the time to join JEDEC for 2013
As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: from components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today.

JEDEC announces the publication of LPDDR2/3 I/O standard
JESD8-22A, HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODT is now available for free download on the JEDEC website. This standard defines the input, output specifications and ac test conditions for devices that are designed to operate in the High Speed Unterminated Logic (HSUL_12) logic switching range, nominally 0 V to 1.2 V. The standard may be applied to ICs operating with separate VDD and VDDQ supply voltages.

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