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February 4, 2013

News for and about the microelectronics industry

Today's Tech Buzz

Fujitsu denies possible plan to combine IC business with Panasonic
Fujitsu is denying a report that the company may work with Panasonic to combine their unprofitable semiconductor businesses over the next year. The Innovation Network Corp. of Japan and the Development Bank of Japan would be involved in the deal, NHK said. "These reports are not based on any official announcement made by Fujitsu or interview between a Fujitsu executive and the media. No decision has been made regarding this matter," Fujitsu said. EE Times India (free registration) (2/4)

ICs, Memory & More

MediaTek's Q4 profit rises 68% from year earlier
MediaTek posted a net profit of $165 million in the fourth quarter, a 68% rise from a year earlier. Its revenue increased 18% in Q4 when compared with the same period in 2011. Fox Business/Dow Jones Newswires (2/4)

Going Green

Ultra-low-power MCU benchmark attracts chip vendors
Microchip Technology, Renesas Electronics and Texas Instruments are among the leading microcontroller vendors that have joined in the Embedded Microprocessor Benchmark Consortium's effort to develop a standard for measuring the energy efficiency of ultra-low-power MCUs, this article notes. Electronics Weekly (U.K.) (2/4)

LEDs could provide "Li-Fi" alternative to Wi-Fi
Researchers at Strathclyde University and other universities in the U.K. are working on micron-sized light-emitting diodes that could transmit Internet data by rapidly flicking on and off. The technology is called Li-Fi and may prove to be an alternative to Wi-Fi wireless communications. The Wall Street Journal/Tech Europe blog (2/4)

Semiconductors in Action

IHS iSuppli: 24.6% of NAND flash will go into smartphones
Nearly one-quarter of NAND flash memory devices produced this year will find their way into smartphones, compared with 23.3% of such devices in 2012, according to IHS iSuppli. Smartphones will leapfrog flash storage cards as the leading NAND flash application in 2013, the market research firm predicts. PC Magazine (2/1)

Kontron packages QorIQ processors in computer-on-modules
To avoid the need for full-custom designs, Kontron is offering Freescale Semiconductor's QorIQ processors in computer-on-module packages, Gerhard Szczuka of Kontron Europe writes in this technical article. "As a rule, there are two ways of defining the best possible QorIQ computer-on-module form factor: Either you define something completely new or you leverage existing technologies," he notes. Electronics Weekly (U.K.) (2/1)

Testing & Standards

Cambridge develops 3DIC with spintronics technology
Cambridge University has come up with a 3D chip incorporating spintronics, which uses the spin of electrons to store or transmit data. The 3DIC has three layers, each only a few atoms deep, and can move data in horizontal and vertical directions, this article notes. Electronics Weekly (U.K.) (2/1)

JEDEC News

JEDEC Mobile Forum 2013 – call for presentations
To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8.

JEDEC updates JESD99, a key reference standard
JESD99C: Terms, Definitions, and Letter Symbols for Microelectronic Devices is now available for free download from the JEDEC website. The standard lists and defines more than 400 of the most common physical and electrical terms applicable to microelectronic devices and shows the industry-standard symbol and abbreviations that have been established for such terms.

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