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February 4, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Fujitsu denies possible plan to combine IC business with Panasonic
    Fujitsu is denying a report that the company may work with Panasonic to combine their unprofitable semiconductor businesses over the next year. The Innovation Network Corp. of Japan and the Development Bank of Japan would be involved in the deal, NHK said. "These reports are not based on any official announcement made by Fujitsu or interview between a Fujitsu executive and the media. No decision has been made regarding this matter," Fujitsu said. EE Times India (free registration) (2/4) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Other News
  Going Green 
  • Ultra-low-power MCU benchmark attracts chip vendors
    Microchip Technology, Renesas Electronics and Texas Instruments are among the leading microcontroller vendors that have joined in the Embedded Microprocessor Benchmark Consortium's effort to develop a standard for measuring the energy efficiency of ultra-low-power MCUs, this article notes. Electronics Weekly (U.K.) (2/4) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • IHS iSuppli: 24.6% of NAND flash will go into smartphones
    Nearly one-quarter of NAND flash memory devices produced this year will find their way into smartphones, compared with 23.3% of such devices in 2012, according to IHS iSuppli. Smartphones will leapfrog flash storage cards as the leading NAND flash application in 2013, the market research firm predicts. PC Magazine (2/1) LinkedInFacebookTwitterEmail this Story
  • Kontron packages QorIQ processors in computer-on-modules
    To avoid the need for full-custom designs, Kontron is offering Freescale Semiconductor's QorIQ processors in computer-on-module packages, Gerhard Szczuka of Kontron Europe writes in this technical article. "As a rule, there are two ways of defining the best possible QorIQ computer-on-module form factor: Either you define something completely new or you leverage existing technologies," he notes. Electronics Weekly (U.K.) (2/1) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Other News
  JEDEC News 
  • JEDEC Mobile Forum 2013 – call for presentations
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8. LinkedInFacebookTwitterEmail this Story
  • JEDEC updates JESD99, a key reference standard
    JESD99C: Terms, Definitions, and Letter Symbols for Microelectronic Devices is now available for free download from the JEDEC website. The standard lists and defines more than 400 of the most common physical and electrical terms applicable to microelectronic devices and shows the industry-standard symbol and abbreviations that have been established for such terms. LinkedInFacebookTwitterEmail this Story
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