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February 21, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • 8-core x86 AMD processor powers Sony's PlayStation 4
    Sony unveiled the PlayStation 4 on Wednesday in New York, revealing that the console is based on a custom Advanced Micro Devices accelerated processing unit with eight "Jaguar" cores. "It's very comparable to a mid- to high-end gaming PC," said Kevin Krewell of The Linley Group. "Even though the CPU is combined with the GPU on one die, like most PC processors today, the higher bandwidth memory and custom design indicates it should have graphics performance more like a discrete GPU found in a gaming PC," he said. TheNextWeb.com (2/21), VentureBeat (2/20) LinkedInFacebookTwitterEmail this Story
Breakthru DDR/LPDDR analysis for both controllers & ICs
New Memory Compliance Analyzer integrates realtime protocol analysis with logic analysis to realize a breakthrough instrument for DDR and LPDDR memory systems. The innovative dual-instrument combination enables memory controller performance monitoring as well as state of the art real-time DDR and LPDDR protocol violation detection. Learn more here.
  ICs, Memory & More 
  • China Ministry of Commerce approves Micron-Elpida merger
    The China Ministry of Commerce gave its blessing to the proposed merger of Micron Technology and Elpida Memory, the companies announced. "China's approval was the last remaining antitrust pre-merger clearance required for completion of the transaction," they said in a statement. Meanwhile, a Micron executive said the memory chip manufacturer will close its wafer fabrication plant in Kiryat Gat, Israel, by 2015 unless a buyer is secured for the facility soon. DigiTimes (2/20), Globes (Israel) (2/20) LinkedInFacebookTwitterEmail this Story
  • Yole: Emerging NV memory market to reach $1.6B in 5 years
    Magnetoresistive random-access memories, phase-change memories and spin transfer torque MRAMs will grow to a $1.6 billion market by 2018, according to Yole Developpement. Such memory chips will go into enterprise storage and mobile phones. When ferroelectric RAMs are factor in, the emerging nonvolatile memory market will reach $2 billion in 2018, Yole said. Electronics Weekly (U.K.) (2/21) LinkedInFacebookTwitterEmail this Story
  • Samsung, 5 others take lion's share of 300mm wafer fab capacity
    Six chipmakers, led by Samsung Electronics, accounted for nearly three-quarters of the global 300-millimeter wafer fabrication capacity in 2012, according to IC Insights. Those same six companies are forecast to continue to dominate 300mm production capacity this year, the market research firm said. EE Times (2/20) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • FD-SOI tech lets processors run at 3 GHz and stay cool, ST says
    STMicroelectronics is using a fully depleted silicon-on-insulator process to fabricate application processors that can operate at 3 gigahertz without overheating, this article notes. The chipmaker claims the FD-SOI technology offers improved energy efficiency compared with bulk complementary metal-oxide semiconductor processes. Electronics Weekly (U.K.) (2/21) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • ZTE will use Nvidia's Tegra 4 in a smartphone
    ZTE plans to offer a smartphone in China in the first six months of 2013 that will be based on the Tegra 4 processor that Nvidia introduced last month, this blog post notes. The Tegra 4 is a quad-core processor based on the Cortex-A15 design from ARM Holdings. TechCrunch (2/20) LinkedInFacebookTwitterEmail this Story
  • Altair to debut LTE-Advanced chip at mobile conference
    Altair Semiconductor plans to introduce a chip supporting the Long-Term Evolution-Advanced wireless standard at next week's Mobile World Congress conference in Barcelona, Spain. The Altair chip is based on software defined radio architecture. GigaOm (2/20) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • Gauging the efficacy of on-chip ADCs for MCUs
    Ralf Hickl looks at four microcontrollers fitted with on-chip analog-to-digital converters to see how they would perform in measuring systems and meter designs in this technical article. The MCUs examined are from Infineon Technologies, Microchip Technology, Renesas Electronics and STMicroelectronics. Electronics Weekly (U.K.) (2/21) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC Mobile Forum: Save the dates
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more. LinkedInFacebookTwitterEmail this Story
  • Updates to JESD21-C: JEDEC Configurations for Solid State Memories now available for free download
    JESD21-C is a compilation of some 3000 of JEDEC memory device standards for solid state memory from September 1989 to the present. In addition to the free downloads available on the JEDEC website, an annual updating service and complete hard copies are also available for purchase. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
Never help a child with a task at which he feels he can succeed."
--Maria Montessori,
Italian physician and educator


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