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December 26, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Report: Mobile devices, SSDs to drive demand for NAND flash
    The value of NAND flash memory devices produced worldwide will increase 15% in 2013, while bit demand for those parts will rise 47.6%, according to DRAMeXchange. The primary factors behind global demand next year will be smartphones and tablet computers, solid-state drives and ultrabook computers, the market research firm said. Average selling prices for NAND flash are expected to decline about 22% in 2013, compared with a fall of nearly 40% this year, DRAMeXchange noted. DigiTimes (12/24) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • TSMC would likely build a wafer fab in N.Y., analyst says
    Taiwan Semiconductor Manufacturing would be most likely to choose the Albany, N.Y., area for building a wafer fabrication plant in the U.S., said Dan Hutcheson of VLSI Research. The silicon foundry would run the risk of trying to recruit Intel employees if it were to build in Arizona or Oregon, he said. "Intel is a good customer of TSMC. So if TSMC puts up a plant and is hiring out of Intel, that's like declaring war on your customer," Hutcheson said. American City Business Journals/Albany, N.Y./BizBlog (12/24) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Stanford researchers create peel-and-stick solar cells
    Researchers at Stanford University have created flexible, thin-film solar cells that can be applied to a variety of surfaces. "This is a far more dramatic development than it may initially seem. All the challenges associated with putting solar cells on unconventional materials are avoided with the new process, vastly expanding the potential applications of solar technology," researchers said. EE Times India (free registration) (12/26) LinkedInFacebookTwitterEmail this Story
Space is going fast:
Register now for JEDEC's DDR4 Workshop

Register today to reserve your spot in Santa Clara, CA for a 2-day, in-depth technical review of the new DDR4 standard on 2/6 & 2/7, taught by industry experts involved in the creation of the standard. Space is very limited — see the agenda and REGISTER NOW for the DDR4 Workshop.
  Semiconductors in Action 
  • Sources: Intel to reveal phone platform, Atom processors in new year
    At an industry conference in February, Intel is expected to bring out a new design platform for smartphones, DigiTimes reports, citing handset component makers. The chipmaker will also unveil low-power Atom processors made with 22-nanometer and 14-nanometer processes, those sources said. DigiTimes (12/25) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  JEDEC News 
  • Space is going fast: register now for the JEDEC DDR4 Workshop
    Save $25 off onsite rates when you register for JEDEC's 2-day DDR4 Workshop on Feb. 6 and 7 in Santa Clara, Calif. This event will offer an in-depth technical review of DDR4, as taught by industry experts involved in the creation of the standard. Participants will gain insight into DDR4's wide range of innovative features and device operation, as well as current and planned technological enablements to facilitate adoption of DDR4. See the agenda and register today. LinkedInFacebookTwitterEmail this Story
  • EDN's "Hot 100 Products of 2012" recognizes over 25 JEDEC member companies
    JEDEC congratulates its many member companies -- too numerous to list here -- whose products were selected for EDN's list of the hot 100 products of 2012. Several members received multiple mentions. Award categories include ICs, test instruments, analog and many more; see the complete list of honorees. LinkedInFacebookTwitterEmail this Story
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--Magdalen Nabb,
British author

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