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November 21, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • TI debuts flash memory chip for harsh environments
    Texas Instruments has introduced the SM28VLT32-HT 4-megabyte nonvolatile flash memory device, which is meant for applications in avionics, industrial environments and oil/gas exploration. It is said to be capable of operating in temperatures of -55 degrees C to 210 degrees C. TI is sampling the chip, with volume production set for the first quarter of 2013. Electronics Weekly (U.K.) (11/21) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • IHS iSuppli: More flash memory headed for smartphones
    In 2013, the number of flash memory devices going into smartphones will increase to 792 million units from this year's 613 million, according to IHS iSuppli. The figure compares with 703 million units meant for feature phones next year, down from this year's 790 million units. This will mark the first time more NAND and NOR flash memory devices will be shipped for smartphones than for feature phones, the market research firm forecast. The Wall Street Journal/Dow Jones Newswires (11/20) LinkedInFacebookTwitterEmail this Story
  • Resistive RAMs are getting bigger and better
    SanDisk and Toshiba will provide details in February on a 32-gigabit resistive random-access memory made with a 24-nanometer process. The test chip has a two-layered architecture, according to a preview of a paper the companies will present at an industry conference in San Francisco. EE Times (11/19) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Freescale powers up app processors
    Freescale Semiconductor has introduced five devices in the i.MX 6 series of application processors, each containing one or more ARM Cortex-A9 processing cores. The processors, now in volume production, can be used in automotive infotainment systems, e-readers, industrial equipment, Internet protocol televisions, medical equipment and tablet computers, according to the company. TMCNet.com (11/20) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Memoright unveils MLC SSDs for cloud computing, other uses
    Memoright has introduced the QuadLife series of solid-state drives, made with multi-level cell NAND flash memory devices. Available in data-storage capacities of 220 gigabytes, 265GB and 530GB, the SSDs can be used in business servers, cloud computing, industrial computers and other applications, according to the company. XBitLabs.com (11/20) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Samsung develops NAND memory with features of 10-19nm
    Samsung Electronics has a 64-gigabit NAND flash memory device in production that has features ranging from 10 nanometers to 19nm, the company reported. The memory chips are in a 64GB embedded multimedia memory card with a high-speed interface that Samsung has submitted to JEDEC for consideration as a possible standard. EE Times (11/20) LinkedInFacebookTwitterEmail this Story
  • ARM, Sprint collaborate on "Internet of Things" dev kit
    ARM Holdings and Sprint Nextel are hoping to help advance "Internet of Things" implementation with a development kit that combines Sprint's mobile broadband USB 598U modem from Sierra Wireless with ARM's mbed development platform. The latter is built around the Cortex-M3 microcontroller design. EE Times (11/20) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Now is the time to join JEDEC for 2013
    As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: from components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today. LinkedInFacebookTwitterEmail this Story
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

  Editor's Note 
  • SmartBrief will not publish Thursday and Friday
    In observance of Thanksgiving in the U.S., SmartBrief will not be published Thursday and Friday. Publication will resume Monday. Enjoy the holiday! LinkedInFacebookTwitterEmail this Story
  SmartQuote 
If the only prayer you said in your whole life was 'thank you,' that would suffice."
--Meister Eckhart,
German theologian and philosopher


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