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- Euro's strength is hurting exports, ST CEO says
As the value of the yen weakens, the euro is gaining strength against the dollar, having a deleterious effect on exports by European companies, according to STMicroelectronics CEO Carlo Bozotti. "We need to have a currency that allows companies in Europe to be competitive in the world," he said Thursday. Meanwhile, ST grew its sales of microelectromechanical system devices and sensors by 19% last year to about $800 million, IHS estimates. The chipmaker claims it has shipped a total of 3 billion MEMS sensors to market. The Wall Street Journal
(1/31), Electronics Weekly (U.K.)
(2/1), Electronics Weekly (U.K.)
(1/31)     
| Going Green | | |
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| Semiconductors in Action | | |
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- Report: Toshiba selects Tegra 4 processor for new tablets
Toshiba is said to be designing Nvidia's Tegra 4 processor into tablet computers that will be released in June, DigiTimes reports, citing supply chain sources in Taiwan. Other tablet makers have yet to choose the Tegra 4, those sources note, giving MediaTek, Qualcomm and other chip design firms a perceived advantage over Nvidia. DigiTimes
(2/1)
- Moo! MEMS-based collar rides herd on dairy cows
Dairymaster has developed the MooMonitor, a collar for dairy cows that is based on a microelectromechanical system device. "The MEMS industry should be taking a much closer look at agriculture and its related industries," said Alissa Fitzgerald of A.M. Fitzgerald & Associates. "Agriculture could potentially be the next big market opportunity for MEMS sensors." EE Times
(2/1)
- TowerJazz adds FleX silicon-on-polymer tech to CMOS process
Tower Semiconductor is implementing American Semiconductor's FleX silicon-on-polymer technology with its CS18 complementary metal-oxide semiconductor process to produce flexible wafers. "FleX is a post-fabrication process that can be applied to our production [silicon-on-insulator] technology making it possible to turn any product into a flexible die helping our customers create new, differentiated solutions," TowerJazz's Marco Racanelli said. Globes (Israel)
(1/31)
| Testing & Standards | | |
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- Analysis: 2013 to mark beginning of transition to DDR4
JEDEC's DDR4 DRAM standard presents a number of advantages and challenges in making the transition from DDR3 DRAMs, Fred Rastgar and Tom Rossi of InStryde write in this technical article. Bill Gervasi of Discobolus Designs says, "DDR4 memory technology offers many advances in terms of performance and lower power operation than the previous DDR3 technology. 2013 is shaping up as a critical period for DDR4 with its advanced silicon process technology as we see a broad range of system application designs aimed at delivering optimum performance and power savings." EE Times
(1/22)
| JEDEC News | | |
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JEDEC Mobile Forum 2013 – call for presentations
To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8.
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