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February 18, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • OCZ chief: SSD market will inevitably consolidate
    The solid-state drive market will surely experience consolidation in the future, but it remains to be seen whether OCZ Technology Group is an acquirer or an acquisition target, OCZ CEO Ralph Schmitt said. Micron Technology and Seagate Technology were interested in buying OCZ at one point, but those courtships didn't come to full flower, XBitLabs reports. Meanwhile, Schmitt said OCZ will continue to use controller chips supplied by other companies for its SSDs, while also develop its own silicon. XBitLabs.com (2/17), XBitLabs.com (2/16) LinkedInFacebookTwitterEmail this Story
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  ICs, Memory & More 
  • Intel's Israeli unit exports more chips, may upgrade fab
    Intel Israel last year increased its exports 109% to $4.6 billion, compared with $2.2 billion in 2011, and is looking at upgrading its Fab 28 facility to make semiconductors with 10-nanometer features. "The average life of a technology is two to six years, so we need to be busy to get the next technology, 10 nanometer," Intel's Maxine Fassberg said. Reuters (2/17) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Qualcomm touts its Quick Charge tech for mobile devices
    Qualcomm has unveiled the Quick Charge 1.0 power management technology for its Snapdragon processors, which it says could recharge a mobile phone up to 40% quicker. Quick Charge is integrated as part of the power management chip or is available on a stand-alone basis interfacing with the USB connector. XBitLabs.com (2/15) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Intel discusses steps toward exascale
    Intel says it's integrating storage and network controllers into the CPU as part of its goal to build an exascale supercomputer within seven years. "Fabrics are starting to become the next bottleneck. To address those bottlenecks ... you need to drive the fabric closer and closer to the processor," Intel's Joe Yaworski says. Network World/IDG News Service (2/15)
  Testing & Standards 
  • Design steps to take in keeping 3DICs cool
    Advanced modeling, simulation and debugging capabilities are required in managing the thermal characteristics of a 3DIC, this article notes. Norman Chang of Apache Design recently presented a paper on this topic. EE Times (2/15) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
    JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
You will become as small as your controlling desire; as great as your dominant aspiration."
--James Allen,
British author


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