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January 29, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • Will GlobalFoundries, TI enter the mix for Powerchip?
    GlobalFoundries and Texas Instruments are interested in acquiring the 12-inch wafer fabrication equipment Powerchip Technology has in its shuttered P3 fab, DigiTimes reports, citing industry sources. Under pressure from its lenders, Powerchip plans to sell the fab's equipment, tear down the facility and sell the property, those sources said. That arrangement would preclude a separate move by Taiwanese memory suppliers to take over the P3 facility, the sources note. DigiTimes (1/28) LinkedInFacebookTwitterEmail this Story
Test & Debug DDR3 & DDR4 in 5 minutes:
In this short video you'll see how to setup and capture live DDR traffic in less than 5 minutes. There's no calibration needed with Teledyne LeCroy's Kibra 480 protocol analyzer. It's the fastest, easiest way to test DDR3 & DDR4 systems for JEDEC compliance. Watch the video here.
  ICs, Memory & More 
  • DRAM contract prices are still increasing, industry sources say
    Recent pricing quotes of more than $20 for 4-gigabit DDR3 memory modules are higher than the $17-$17.50 contract prices quoted earlier this month, indicating that DRAM contract prices will continue to increase next month, industry sources tell DigiTimes. If the price rises go on this year, memory suppliers could become profitable again, those sources noted. DigiTimes (1/28) LinkedInFacebookTwitterEmail this Story
  Going Green 
 
  • Microchip offers analog DC-DC converter with digital control
    Microchip Technology has introduced the MCP19111 analog DC-DC converter, which has digital microprocessor and analog blocks on the same chip. Explaining why digital control is implemented on an analog chip, Microchip's Steve Stella said, "All-analog works very well if you have a single operating point, but it is prohibitively expensive to get the flexibility for more than one operating point." Electronics Weekly (U.K.) (1/29) LinkedInFacebookTwitterEmail this Story
Last chance to save: online registration ends 1/31 for JEDEC's DDR4 Workshop
Save over onsite rates when you register online by 1/31. Reserve your spot today for a 2-day, in-depth technical review of the new DDR4 standard on 2/6 & 2/7 in Santa Clara, CA, taught by industry experts involved in its development. See the agenda and REGISTER NOW for the DDR4 Workshop.
  Semiconductors in Action 
  • Seagate invests in Virident; companies to offer PCIe SSDs
    Seagate Technology and Virident Systems concluded a strategic partnership agreement that includes Seagate making an equity investment of $40 million in Virident, this article notes. The deal enables Seagate to offer PCIe solid-state drives based on NAND flash memory devices for cloud-computing and enterprise data centers. Computerworld (1/28) LinkedInFacebookTwitterEmail this Story
  • Intel CEO: No integrated app processor/LTE modem chip for a year
    Intel won't be able to offer an application processor integrated with a Long-Term Evolution modem until next year, at the earliest, CEO Paul Otellini said. The delay may put the chipmaker at a competitive disadvantage with Qualcomm, Renesas Electronics and ST-Ericsson. EE Times (1/28) LinkedInFacebookTwitterEmail this Story
  • Report: Nvidia to market white-label mobile processors to OEMs
    Nvidia wants to build up its market share in application processors for mobile devices and plans to offer white-label reference designs to manufacturers in China and Russia, the Unwired View website reports. The company has successfully followed a similar strategy with its graphics cards, the website notes. TechCrunch (1/28) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • Cadence debuts design software for 20nm chips
    Cadence Design Systems has introduced the Virtuoso Advanced Node software suite for designing semiconductors with 20-nanometer features. The company says the new tools can handle color-aware layout, double-patterning lithography, layout-dependent effects and routing layers. Electronics Weekly (U.K.) (1/29) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • JEDEC welcomes new members to the Association
    JEDEC is the global leader in developing standards for the microelectronics industry, bringing together over 4,000 member company volunteers in 50 technical committees to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to the following new members: AVX Tantalum, Embed Technology, Kandou Bus, Memoright Corp., Shenzhen Deren Electronic Co. and StorArt Technology. Interested in JEDEC membership for your company? Find out more about the benefits of membership and apply online. LinkedInFacebookTwitterEmail this Story
  • Looking for expert insights into the new DDR4 standard?
    Register now for JEDEC's 2-day DDR4 Workshop on Feb. 6 and 7 in Santa Clara, Calif., offering an in-depth technical review of DDR4 as taught by industry leaders involved in the creation of the standard. Presenters include representatives from Agilent, AMD, Inphi, Intel, Micron, Montage, Samsung and SK hynix. See the agenda and register today -- online registration and discounts end this Thursday. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
I attribute my success to this: I never gave or took any excuse."
--Florence Nightingale,
British social reformer, nurse and statistician


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