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January 30, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • SK Hynix tops analyst estimates on Q4 profit
    SK Hynix posted an operating profit in the fourth quarter, after losing money a year earlier, as sales increased 6.5%. Its net income of $151 million was more than one-third higher than the average analyst estimate compiled by Bloomberg. "SK Hynix has a big presence in China's mobile chip market," said Oh Sang Woo of Leading Investment & Securities, noting that Huawei Technologies, Lenovo Group and ZTE are growing at a rapid pace. Bloomberg (1/29) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Report: Bankers choose GlobalFoundries, TI bid to buy P3 fab gear
    A group of lenders holding the wafer fabrication equipment in Powerchip Technology's shuttered P3 fab as collateral is said to have chosen to sell most of the equipment to GlobalFoundries and Texas Instruments, industry sources tell DigiTimes. Elite Semiconductor Memory Technology and other Taiwanese companies had offered to purchase the idle Powerchip facility but were rebuffed by the banking consortium, the sources said. DigiTimes (1/29) LinkedInFacebookTwitterEmail this Story
  • AMD adds quad-core "Vishera" processor
    Advanced Micro Devices has introduced the FX-4130, a quad-core processor with its "Vishera" core design and the "Piledriver" microarchitecture. The chip is specified to run at 3.80 gigahertz and can be pushed up to 3.90GHz, according to the company. (1/29) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • Other News
  Semiconductors in Action 
  • Infineon unveils "coil on module" IC package for smart cards
    The new "coil on module" semiconductor packaging from Infineon Technologies is meant to be used in dual-contact smart cards, facilitating contactless payments. "Our 'coil on module' solution enables card manufacturers to ramp up volumes with a simplified production process, better yield and overall lower manufacturing costs than with conventional dual-interface modules," Infineon's Thomas Rosteck said. EE Times Europe (1/29) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Nvidia exec: "Engineers don't complain enough" about design tools
    IC design engineers need to complain more about inadequate chip design software and avoid "cultural complacency," Nvidia's Jonah Alben said in a keynote address California this week. "Engineers like myself tend to ultimately figure out a way to live with whatever environment they're put into," Alben said Tuesday. "They don't speak up when everyone else is speaking up in the company about what we want to see in the next-generation product." EE Times (1/29) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • Last chance to save: online registration ends Thursday for JEDEC's DDR4 Workshop
    Register now for JEDEC's 2-day DDR4 Workshop on Feb. 6 and 7 in Santa Clara, Calif., offering an in-depth technical review of DDR4 as taught by industry leaders involved in the creation of the standard. Presenters include representatives from Agilent, AMD, Inphi, Intel, Micron, Montage, Samsung and SK Hynix. See the agenda and register today -- online registration and discounts end this Thursday. LinkedInFacebookTwitterEmail this Story
  • JEDEC Mobile Forum 2013 – call for presentations
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8. LinkedInFacebookTwitterEmail this Story
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