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February 13, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  ICs, Memory & More 
  • IBM details future IC fabrication processes
    Representatives of IBM provided details of what the company plans to do in making future generations of semiconductors, such as substituting double patterning with immersion lithography in the place of extreme ultraviolet lithography. IBM's Gary Patton said, "I believe [complementary metal-oxide semiconductor] scaling will continue, [but] it will require disruptive technologies such as carbon nanotubes and silicon photonics." EE Times (2/12) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • ICs get more powerful while consuming less power
    Chips going into mobile devices, medical electronics and other applications continue to gain in processing power, while becoming more energy efficient, Stephen Kosonocky of Advanced Micro Devices notes. "Energy efficiency has become the main challenge in designing application processors, graphics processors, media processors (video, image, audio) and modems (cellular, WLAN, GPS, Bluetooth)," he writes. ElectroIQ (2/12) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • A $100 tablet? ARM exec says there's a Cortex core for that
    Developing smartphones and tablet computers priced at $100 would open up the wireless world to more people around the world, says Dipesh Patel of ARM Holdings. He suggested such products could be realized using ARM's Cortex-A7 and Cortex-A5 designs. EE Times (2/12) LinkedInFacebookTwitterEmail this Story
  • Neul offers "white spaces" RF chipset
    Neul is sampling a radio-frequency chipset designed to make use of the "white space" in the public spectrum for wireless communications. The frequencies may be used for low-power communications with chips to enable a wider variety of products to be connected to the Internet. Neul used a standard-in-progress developed by the Weightless Special Interest Group, a U.K. industry organization. GigaOm (2/12) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • Agilent's Keller: How and why DDR4 timing is important
    JEDEC's DDR4 DRAM standard is compatible with 3DIC architectures and is capable of data transfer rates up to 3.2 gigatransfers per second, Kristin Lewotsky notes in this article. "We've got a broad population of folks who really haven't had the time or the business need to learn about DDR4," says Perry Keller of Agilent Technologies. "What we hope to do is familiarize them with DDR4: What it is, why it exists, what it can bring to their products, and how to do something practical with it." EE Times (2/12) LinkedInFacebookTwitterEmail this Story
  • Algorithm wipes memory chips on mobile handsets
    U.K.-based BlackBelt Smartphone Defence has developed BlackBelt DataWipe, a software algorithm that it says can completely delete data on the flash memory chips of a mobile phone. The algorithm is said to work with the wear leveller software on memory chips. "It is like having a shredder for personally identifiable data," BlackBelt's Ken Garner says. Electronics Weekly (U.K.) (2/12) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Updates to JESD21-C: JEDEC Configurations for Solid State Memories now available for free download
    JESD21-C is a compilation of some 3000 of JEDEC memory device standards for solid state memory from September 1989 to the present. In addition to the free downloads available on the JEDEC website, an annual updating service and complete hard copies are also available for purchase. LinkedInFacebookTwitterEmail this Story
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