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March 20, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • Analyst: Intel pushes back selection of a new CEO
    Piper Jaffray analyst Gus Richard said Tuesday that Intel may not be ready to name a successor upon CEO Paul Otellini's expected retirement in May. "We believe Intel has narrowed down CEO candidates to two internal and one external, but the final decision appears to be slipping," Richard wrote in a research note. CNET, citing a chip industry source, reported that the two internal candidates are said to be Brian Krzanich and David Perlmutter, while the external is former Motorola Mobility CEO Sanjay Jha. Richard also speculated that Intel won't produce chips for Apple's mobile devices until 2015 at the earliest. CNET/Business Tech blog (3/19), CNET/Business Tech blog (3/19) LinkedInFacebookTwitterEmail this Story
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  ICs, Memory & More 
  • 3DIC market will grow nearly 20% in next 3 years, firm says
    The worldwide 3DIC market is projected to grow an average of 19.7% by 2016, with DRAMs and flash memory devices largely driving that increase, according to Infiniti Research. Advanced Semiconductor Engineering, Samsung Electronics, STMicroelectronics and Taiwan Semiconductor Manufacturing are the largest 3DIC vendors now, according to the market-research firm. TechEye.net (3/19) LinkedInFacebookTwitterEmail this Story
  • Sources: IC design firms will keep SMIC busy in Q2
    With increasing orders from IC design firms in China and Taiwan, Semiconductor Manufacturing International is likely to operate at 90% production capacity during the second quarter, DigiTimes reports, citing industry sources. Allwinner Technology and Rockchip Electronics are among those placing more orders with the Chinese foundry because of demand for chips going into tablet computers for the Chinese market, the sources said. DigiTimes (3/19) LinkedInFacebookTwitterEmail this Story
  • Analysis: XMC wants to be a bigger player in the foundry business
    China's Wuhan Xinxin Semiconductor Manufacturing has changed its name to XMC and aspires to a higher profile in the silicon foundry business, Junko Yoshida writes. XMC won't go head-to-head with Taiwan Semiconductor Manufacturing or GlobalFoundries, she notes. The company will provide "anything but a mainstream offering," says XMC's Walter Lange. "We customize our process technology for our customers," he says. EE Times (3/19) LinkedInFacebookTwitterEmail this Story
  • XMC will make 32nm flash memories for Spansion: Spansion and XMC have agreed that the silicon foundry will now make NOR flash memory devices with 32-nanometer features for Spansion. XMC, formerly known as Wuhan Xinxin Semiconductor Manufacturing, previously made 65- and 45-nanometer memory chips for Spansion, using XMC's 300-millimeter wafer fabrication facility in Wuhan, China. DigiTimes (3/19) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • Other News
  Semiconductors in Action 
 
  • Nvidia looks to the cloud with new appliance
    Nvidia has developed the Grid Visual Computing Appliance, a computer that promises to offer engineering workstation performance at a lower price, offloading compute-intensive processing to cloud-based servers. The product goes on sale in May, priced at $24,900 and up, and also carries an annual software license fee of $2,400. Nvidia also offered details of its Tegra line of mobile processors and its graphics processing units that go into PCs, workstations, servers and supercomputers. The Wall Street Journal (3/19), CNET (3/19), CIO.com/IDG News Service (3/19) LinkedInFacebookTwitterEmail this Story
  • IHS iSuppli estimates costs for the Samsung Galaxy S4
    The new Samsung Electronics Galaxy S4 smartphone has materials worth an estimated $233 to $236, depending on the version of the handset, according to IHS iSuppli, which conducted a "virtual teardown" of the phone. "Although its hardware is not radically different from the Galaxy S3 introduced in April of 2012, the Samsung Galaxy S4 includes some critical component updates that enhance its functionality," IHS iSuppli's Vincent Leung said in a statement. Bloomberg Businessweek (3/19), CNET (3/19) LinkedInFacebookTwitterEmail this Story
Last chance to save: early bird rates end 3/22 for JEDEC's Mobile Forum 2013
Save $50 over onsite rates when you register online by 3/22. Reserve your spot in Santa Clara, CA on 5/1 &2 where we'll examine the industry's latest memory and storage-related advancements & new standards enabling applications and impacting mobile devices such as smartphones and tablets. See the agenda and REGISTER NOW for the Mobile Forum.
  Testing & Standards 
  • Swiss researchers create advanced flash memory
    Researchers in Switzerland have developed a flash memory device using layers of graphene and molybdenum disulfide that are only one atom or one molecule in thickness. Additional work on the devices must be done, however, before they are ready for commercial production, according to this article. Ars Technica (3/19) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Register now for the 28th annual ROCS (Reliability of Compound Semiconductors) Workshop
    Join us on May 13 in New Orleans, La., where the ROCS Workshop will once again be held with the CS MANTECH conference; bringing together researchers, manufacturers and users of compound semiconductor devices. Visit the event website or register now -- online registration and discounts end April 29 and space is limited, so don't delay! LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
Quality is not an act, it is a habit."
--Aristotle,
Greek philosopher


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