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February 26, 2013
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  ICs, Memory & More 
  • Toshiba will install Hisao Tanaka as president this summer
    Hisao Tanaka will succeed Norio Sasaki as president of Toshiba in June, subject to shareholder approval. Tanaka has been with Toshiba for 40 years and serves as a corporate senior executive vice president. Sasaki will become vice chairman of Toshiba in the management transition. Bloomberg (2/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • TSMC to fabricate low-power app processors for Qualcomm
    Qualcomm will have Taiwan Semiconductor Manufacturing fabricate its low-power application processors with the foundry's 28-nanometer High Performance Mobile process. The resulting chips will be able to operate at 2.3 gigahertz per core while consuming 750 milliwatts of power, the companies said. TechEye.net (2/25) LinkedInFacebookTwitterEmail this Story
  • Ruckus Wireless takes a different approach to small cells
    Ruckus Wireless introduced the SmartCell 8800 platform this week at an event in Spain. The product combines a cellular radio with a Wi-Fi access point and can be mounted on a lamppost to provide wireless networking over a small area. Broadcom also plans to bring out a variety of wireless chips at this week. CIO.com (2/25) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • Intel signs up Altera as a foundry customer
    Intel will make chips for Altera on a contract manufacturing basis, significantly expanding its silicon foundry business, this article notes. Altera's field-programmable gate arrays will be made with the 14-nanometer process Intel has under development. Reuters (2/25) LinkedInFacebookTwitterEmail this Story
  • Nvidia bets on Android games as it markets the Shield
    Nvidia is following gamers out of the living room with plans to market its hand-held Shield device, which was introduced at last month's International CES and will hit the market in the second quarter. The graphics chip company is touting the future of Android-based mobile game platforms, which can wirelessly connect to television sets and some PCs. Bloomberg (2/25) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • SanDisk, Toshiba develop dual-layer ReRAM
    SanDisk and Toshiba reported they have been able to develop a prototype of a two-layer, 32-gigabit resistive random-access memory chip with a 24-nanometer process. Resistive RAMs are expected to replace NAND flash memory devices in the future, Peter Clarke notes in this article. EE Times (2/25) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
    JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry. LinkedInFacebookTwitterEmail this Story
  • JEDEC Mobile Forum: Save the dates
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more. LinkedInFacebookTwitterEmail this Story
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