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November 7, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • JEDEC, ONFI bring out NAND flash interface standard
    The JESD230 NAND flash interface interoperability standard has been published by JEDEC, working in cooperation with the Open NAND Flash Interface workgroup. "By joining forces to develop and publish JESD230, ONFI and JEDEC have responded to the industry's need for interoperability among NAND vendors, which will enable even broader use of NAND flash in a wide variety of applications," said Intel's Amber Huffman. (11/6) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • CPU shipments were off by 9% in Q3, report says
    Shipments of x86 microprocessors declined by about 9% in the third quarter compared with a year ago, Mercury Research says. Intel expanded its market share to 83.3% in the quarter, while Advanced Micro Devices share fell to 16.1%. The economy and reduced demand for PCs hurt the processor market in Q3, Mercury Research said. News Service (11/6), (11/6) LinkedInFacebookTwitterEmail this Story
  • Analysts: ARM, Imagination to square off loaded with MIPS patents
    ARM Holdings and Imagination Technologies may be going head-to-head in the semiconductor intellectual property market after separately wrapping up deals for assets and patents held by MIPS Technologies, according to industry analysts. FinnCap analyst Lorne Daniel said, "We see this as a defensive move to meet the challenge of ARM, which has eaten into Imagination's core PowerVR graphics chip market." Reuters (11/6), Bloomberg (11/6) LinkedInFacebookTwitterEmail this Story
  • AMD works on new graphics card, website reports
    Advanced Micro Devices is developing a graphics card with the Tahiti-LE graphics processing unit, positioning the product between its Radeon HD 7870 and Radeon HD 7950 graphics cards, according to the HT4U website. AMD did not comment on the report. (11/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Linear offers monolithic switching battery charging chip
    The new LTC4155 monolithic switching battery charger from Linear Technology is said to efficiently deliver a 3.5-ampere charge in a small printed circuit board footprint. This technical article details how the chip can be used to manage power in a USB product. EE Times (11/6) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • TI debuts wireless charging IC for mobile devices
    Texas Instruments has introduced the bq51050B chip for wireless recharging of smartphones and tablet computers, employing the Wireless Power Consortium 1.1 standard for Qi-compliant mobile devices. The chipmaker also debuted the bq500410A wireless power transfer controller chip. Computerworld (11/7) LinkedInFacebookTwitterEmail this Story
  • X-Fab makes high-speed nonvolatile memory chip
    Using nonvolatile static random-access memory technology developed by Anvo-Systems, X-FAB Semiconductor Foundries is offering a memory chip bringing together DRAM, SRAM and SONOS flash technology. The resulting chips can be used in automotive, biotech, communication, industrial and medical applications, the companies noted. Electronics Weekly (U.K.) (11/6) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Mentor CEO: Interconnect designs can be applied to auto electronics
    Wally Rhines, CEO of Mentor Graphics, sees the model of chip interconnection technology being applied to automotive electronics design through emulation and simulation systems. "In chip design, there was a move to simulation as the complexity became too great for manual techniques, and this will happen in automotive electronics. It is inevitable; wiring complexity is increasing and the design systems are available to achieve this," he said. Electronics Weekly (U.K.) (11/7) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
  • JEDEC and ONFI publish NAND flash interface interoperability standard
    JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both and LinkedInFacebookTwitterEmail this Story
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Success is often just an idea away."
--Frank Tyger,
American cartoonist, columnist and humorist

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