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November 20, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • Who will fill Otellini's shoes at Intel?
    Intel CEO Paul Otellini says he'll retire in May. Intel traditionally has chosen insiders for its top post, and it promoted three executives Monday who may have the inside track to the CEO's office: Chief Operating Officer Brian Krzanich, Chief Financial Officer Stacy Smith and Renée James, general manager of the Software and Services group, were named executive vice presidents. San Jose Mercury News (Calif.) (free registration) (11/19), Reuters (11/19), CNET (11/19), EE Times (11/19) LinkedInFacebookTwitterEmail this Story
Texas Instruments is now sampling the industry's first high temperature 4MB Flash memory device for Harsh Environments. Designed for data logging and firmware designs, TI's SM28VLT32-HT provides high temperature Flash read and writing operation and small ruggedized packaging tailored for extreme temperatures from -55°C to 210°C.
  ICs, Memory & More 
  • U.S. Bankruptcy Court will reconsider Elpida patent deals
    A judge in the U.S. Bankruptcy Court will review a patent sale between Elpida Memory and Rambus as part of the process in considering Micron Technology's proposed acquisition of Elpida. A Japanese court has given its approval to the Elpida-Rambus patent deals, but disgruntled Elpida bondholders are hoping the American court may somehow prevent the Micron acquisition from closing. The Wall Street Journal/Dow Jones Newswires (11/19) LinkedInFacebookTwitterEmail this Story
  • AMD's Q4 layoffs won't be the end of restructuring
    After reducing its workforce 15% in this quarter, Advanced Micro Devices will continue its cost-cutting and restructuring in 2013, this blog post notes. "As we communicated during our third quarter earnings results, we expect to take further restructuring actions in the first half of 2013," AMD said in a statement, adding: "We have not provided any updates since then and do not comment on rumor or speculation." XBitLabs.com (11/19) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Methanol fuel cells as generator alternatives
    Fuel cells running on methanol are being developed by Nokia Siemens Networks and Ballard Power Systems as a backup source of power for mobile networks. Paired with a base station, the fuel cells are being tested with NTT DoCoMo, this article notes. While the fuel cells consume more fuel per hour than diesel generators, they need less maintenance than diesel units and methanol costs less than diesel fuel, it was said. Network World/IDG News Service (11/19) LinkedInFacebookTwitterEmail this Story
  • Imagination debuts ultra-low-power GPU for gadgets
    Imagination Technologies has introduced the PowerVR G6630 graphics processing unit core, outfitted with six shader execution clusters. The PowerVR G6630 is designed to be used in low-power gadgets, smartphones and tablet computers. XBitLabs.com (11/19) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Qualcomm IC-based devices to get free cloud storage
    Android-based devices with Qualcomm's Snapdragon S4 MSM 8x25 and Snapdragon S4 MSM 8x25Q processors will get up to 30 gigabytes of cloud storage for free from Baidu, the largest search engine company in China. Baidu has been working with Dell and other companies to provide handsets with built-in access to its Baidu Cloud platform. CIO.com/IDG News Service (11/19) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • NIST, USC researchers fine-tune carbon nanotube production
    Researchers at the University of Southern California and the National Institute of Standards and Technology have come up with a way to make carbon nanotubes with predictable diameters and symmetry. The research team has adapted the chemical vapor deposition process for fabricating carbon nanotubes to produce more consistent results. EE Times (11/19) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
  • Now is the time to join JEDEC for 2013
    As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: from components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
A good man with a good conscience doesn't walk so fast."
--Georg Büchner,
German writer


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