Reading this on a mobile device? Try our optimized mobile version here:

February 28, 2013
Sign upForwardArchiveAdvertise
News for and about the microelectronics industry

  Today's Tech Buzz 
  • The miniaturization of smartphones inspires other uses
    Smartphones have become so powerful as computing, imaging and sensing platforms that engineers are looking to their design to find solutions for other applications, this article notes. When the Fraunhofer Institute for Integrated Circuits in Germany was tasked with designing a camera module that could be attached to an eagle, they took components from a smartphone. A movie from the footage the eagle cam was able to produce is scheduled for release next year. News Service (2/27) LinkedInFacebookTwitterEmail this Story
Free Memory Webcasts
Every generational change of memory standards puts new risks in your path. We see it firsthand when creating our products and working with engineers like you. Agilent’s broad memory expertise is built on our ongoing involvement with JEDEC. By sharing this expertise, in this webcast series, we can help you anticipate your next design challenges.
  ICs, Memory & More 
  • Report: Taiwan will outdo the world in IC packaging/testing
    Semiconductor packaging and testing contractors in Taiwan will turn out a production value of $13.88 billion this year, up 4.9% from 2012, Digitimes Research forecasts. In contrast, the worldwide IC packaging/testing industry is forecast to increase 2.4% in production value during 2013, according to the market research firm. DigiTimes (2/26) LinkedInFacebookTwitterEmail this Story
  • Coming soon to a smartphone near you: Ultrasound technology
    Qualcomm, in the fourth quarter of 2012, acquired the assets of EPOS that developed digital ultrasound technology, and it plans to incorporate the technology into chips that would go into not only mobile devices, but also wearable electronics. Ultrasound could facilitate the use of a stylus as an input device and gesture recognition for smartphones and tablet computers, it was said. TechCrunch (2/27) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • TI debuts 35V power management gate drivers
    Texas Instruments has introduced the UCC27531 and UCC27532 output stage gate drivers for use with insulated-gate bipolar transistors and silicon carbide field-effect transistors. The 35-volt gate drivers can split their outputs, according to TI, and are meant for applications in electric vehicle chargers, solar inverters and uninterruptible power supplies. Electronics Weekly (U.K.) (2/27) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • ON debuts 2 clock distribution chips
    ON Semiconductor unveiled two clock distribution ICs, the NB6L56 and NB3F8L3010C. Both chips feature ultra-low jitter performance for communications and networking applications, according to the chipmaker. (2/27) LinkedInFacebookTwitterEmail this Story
  • Scottish firm offers A/V, touch control on one IC
    Future Technology Devices International of Glasgow, Scotland, has introduced the FT800, a chip designed to combine audio, video and touch control on one device. The IC is meant for small, high-resolution displays in consumer and industrial electronics. EE Times (2/27) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • French lab uses plastic foil to produce an ADC
    CEA-Liten in France has been able to fabricate an analog-to-digital converter on plastic foil, this article notes. The advanced work in organic transistors is a collaborative effort of CEA-Liten, the Eindhoven University of Technology, STMicroelectronics and the University of Catania. Electronics Weekly (U.K.) (2/28) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
    JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry. LinkedInFacebookTwitterEmail this Story
  • JEDEC Mobile Forum: Save the dates
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

He that will not apply new remedies must expect new evils; for time is the greatest innovator."
--Francis Bacon,
British author and statesman

LinkedInFacebookTwitterEmail this Story

Subscriber Tools
Print friendly format | Web version | Search past news | Archive | Privacy policy

Account Director:  Roger Leek (804) 803-1414
A powerful website for SmartBrief readers including:
 Recent JEDEC SmartBrief Issues:   Lead Editor:  Susan Rush
Contributing Editor:  Jeff Dorsch
Mailing Address:
SmartBrief, Inc.®, 555 11th ST NW, Suite 600, Washington, DC 20004
© 1999-2013 SmartBrief, Inc.® Legal Information