| News for and about the microelectronics industry |  |
- The miniaturization of smartphones inspires other uses
Smartphones have become so powerful as computing, imaging and sensing platforms that engineers are looking to their design to find solutions for other applications, this article notes. When the Fraunhofer Institute for Integrated Circuits in Germany was tasked with designing a camera module that could be attached to an eagle, they took components from a smartphone. A movie from the footage the eagle cam was able to produce is scheduled for release next year. CIO.com/IDG News Service
(2/27)     
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| ICs, Memory & More |  |  |
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- Report: Taiwan will outdo the world in IC packaging/testing
Semiconductor packaging and testing contractors in Taiwan will turn out a production value of $13.88 billion this year, up 4.9% from 2012, Digitimes Research forecasts. In contrast, the worldwide IC packaging/testing industry is forecast to increase 2.4% in production value during 2013, according to the market research firm. DigiTimes
(2/26)
- Coming soon to a smartphone near you: Ultrasound technology
Qualcomm, in the fourth quarter of 2012, acquired the assets of EPOS that developed digital ultrasound technology, and it plans to incorporate the technology into chips that would go into not only mobile devices, but also wearable electronics. Ultrasound could facilitate the use of a stylus as an input device and gesture recognition for smartphones and tablet computers, it was said. TechCrunch
(2/27)
| Going Green | | |
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- TI debuts 35V power management gate drivers
Texas Instruments has introduced the UCC27531 and UCC27532 output stage gate drivers for use with insulated-gate bipolar transistors and silicon carbide field-effect transistors. The 35-volt gate drivers can split their outputs, according to TI, and are meant for applications in electric vehicle chargers, solar inverters and uninterruptible power supplies. Electronics Weekly (U.K.)
(2/27)
| Semiconductors in Action | | |
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- ON debuts 2 clock distribution chips
ON Semiconductor unveiled two clock distribution ICs, the NB6L56 and NB3F8L3010C. Both chips feature ultra-low jitter performance for communications and networking applications, according to the chipmaker. TMCNet.com
(2/27)
- Scottish firm offers A/V, touch control on one IC
Future Technology Devices International of Glasgow, Scotland, has introduced the FT800, a chip designed to combine audio, video and touch control on one device. The IC is meant for small, high-resolution displays in consumer and industrial electronics. EE Times
(2/27)
| Testing & Standards | | |
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- French lab uses plastic foil to produce an ADC
CEA-Liten in France has been able to fabricate an analog-to-digital converter on plastic foil, this article notes. The advanced work in organic transistors is a collaborative effort of CEA-Liten, the Eindhoven University of Technology, STMicroelectronics and the University of Catania. Electronics Weekly (U.K.)
(2/28)
| JEDEC News | | |
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JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry.
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JEDEC Mobile Forum: Save the dates
To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more.
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 | He that will not apply new remedies must expect new evils; for time is the greatest innovator."
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