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December 10, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • STMicroelectronics will sell its stake in ST-Ericsson JV
    STMicroelectronics will divest its stake in ST-Ericsson, its 50/50 joint venture with Ericsson, as part of its restructuring efforts. The chipmaker is in discussions with Ericsson on unwinding its role in ST-Ericsson, which lost $841 million last year and which Kepler Capital Markets analyst Sebastien Sztabowicz estimates will lose $900 million this year. Bloomberg (12/10) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • IC Insights: Cellphone chips will outsell PC chips in 2013
    In 2013, sales of chips for mobile phones will total $70.7 billion while those going into PCs will account for $65.1 billion, according to a forecast by IC Insights. PC chips will barely outsell phone ICs this year, with 25% revenue market share compared with 24% for mobile chips, the market research firm reports. By 2016, phone chips will represent nearly one-third of the worldwide semiconductor market and PC chips will be one-fifth, the firm predicts. Electronics Weekly (U.K.) (12/7) LinkedInFacebookTwitterEmail this Story
  • China gives go-ahead to JV for security software on ARM chips
    A joint venture of ARM Holdings, Giesecke & Devrient and Gemalto to develop software for secure mobile payments with ARM-based processors in smartphones received regulatory approval in China, Market Watch reports. The country's Ministry of Commerce stipulated that ARM must disclose details of its TrustZone security technology to competitors, a condition that was also imposed by the European Commission, it was said. EE Times (12/7) LinkedInFacebookTwitterEmail this Story
  • Imagination duels with Ceva in bidding for MIPS business, patents
    Imagination Technologies upped the ante in its offer to acquire the operating business of MIPS Technologies and 82 MIPS patents, increasing its bid from $60 million to $80 million after Ceva made a competing bid for those properties, Richard Wilson writes. Another set of MIPS patents is being sold to a bidding group led by ARM Holdings for $350 million. Electronics Weekly (U.K.) (12/10) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Toshiba creates low-power MRAM for smartphone use
    Aiming to reduce power consumption by mobile processors, Toshiba has crafted a low-power magnetoresistive random-access memory, which can serve as cache memory in smartphones. The company will detail the MRAM technology in a presentation at the IEEE International Electron Devices Meeting that begins today in San Francisco. PCAdvisor.co.uk (U.K.) (12/10) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Crocus, foundry to make magnetic logic devices with 45nm process
    Crocus Technology and Semiconductor Manufacturing International plan to fabricate microcontrollers using magnetic logic unit technology with features as small as 45 nanometers. The MCUs are meant to be used in secure data servers and smartcards, among other applications. EE Times (12/7) LinkedInFacebookTwitterEmail this Story
  • Showa Denko to offer 650GB platters for HDDs next year
    Showa Denko, a supplier of magnetic media to Seagate Technology, Toshiba and Western Digital, said next year it will offer 650-gigabyte platters for 2.5-inch hard-disk drives using perpendicular magnetic recording technology. In 2014, the company expects to advance to thermally-assisted magnetic recording. XBitLabs.com (12/10) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • IBM to detail new way to make optical components
    IBM will present details this week on how it was able to incorporate optical modulators and photodetectors on a silicon-based semiconductor device, using a standard 90-nanometer process. With this fabrication technique, it may be possible to make optical components with data transmission rates of 25 gigabits per second to 1 terabit per second, according to IBM. ITWorld.com/IDG News Service (12/10), CNET/Business Tech blog (12/9) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • Back by popular demand: JEDEC to hold DDR4 Workshop in February 2013
    Join us in Santa Clara, Calif., on Feb. 6 and 7 for an in-depth technical review of DDR4, as taught by industry experts involved in the creation of the standard. Participants will gain insight into DDR4's wide range of innovative features and device operation, as well as current and planned technological enablements to facilitate adoption of DDR4. See the agenda and register today -- space is very limited and early bird discounts end 12/21. LinkedInFacebookTwitterEmail this Story
  • EE Times takes a first look at JESD230 NAND Flash interface interoperability standard
    JEDEC and ONFI talk with EE Times Memory Designline editor Kristin Lewotsky in this informative Q-and-A about JESD230. The standard is available for free download from both www.jedec.org and www.onfi.org. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
Alas for those that never sing, But die with all their music in them."
--Oliver Wendell Holmes Sr.,
American physician, writer and poet


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