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March 15, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
 
  • Samsung Galaxy S4 features souped-up app processor
    The Samsung Galaxy S4 smartphone, unveiled Thursday evening at a news conference in New York, is based on Samsung's Exynos 5 Octa application processor, which will go into volume production in the second quarter. The processor will have four or eight cores. The U.S. version of the phone, however, is expected to be built around Qualcomm's Snapdragon 600 APQ8064T application processor, a quad-core chip. Multiple carriers will sell the phone starting in the second quarter. XBitLabs.com (3/14), CNET (3/14) LinkedInFacebookTwitterEmail this Story
DDR4 Design Considerations: Payback & Pitfalls
This Free Webinar explores key technical challenges designers will face in order to maximize the benefit of DDR4 power and performance enhancements. A perfect introduction to DDR4, attendees will learn how to balance DDR4's power management features with its corresponding goal of higher performance. Register
  ICs, Memory & More 
  • Sources: Demand for TV chips rises ahead of Chinese holiday
    MediaTek, MStar Semiconductor, Novatek Microelectronics, Realtek Semiconductor and other IC design houses in Taiwan are reporting a pickup in orders for television chips ahead of China's Labor Day holiday in May, DigiTimes reports, citing industry sources. Television manufacturers across Asia are stepping up their production in expectation of holiday shopping sales in China during the month of May, those sources said. DigiTimes (3/14) LinkedInFacebookTwitterEmail this Story
  • Qualcomm RFIC could shake up front-end, power amp market
    Qualcomm's introduction of the RF360 radio-frequency front-end chip for mobile devices could be a game-changer in the market for RF front-end modules and power amplifiers, according to Strategy Analytics. The market research firm's Christopher Taylor notes Qualcomm is offering a complementary metal-oxide semiconductor power amp as an alternative to multiband, multimode PAs made with gallium arsenide. Electronics Weekly (U.K.) (3/14) LinkedInFacebookTwitterEmail this Story
 
  • Other News
  Going Green 
  • Other News
  Semiconductors in Action 
  • Nvidia exec: We deliberately chose not to get involved with the PS4
    Nvidia made a conscious decision to pass on participating in the development of Sony's PlayStation 4 console, choosing instead to focus on mobile application processors and other products, a company executive claimed. "I am sure there was a negotiation that went on and we came to the conclusion that we did not want to do the business at the price those guys were willing to pay," Nvidia's Tony Tamasi said in an interview with the GameSpot website. He added, "Having been through the original Xbox and PS3, we understand the economics of [console development] and the trade-offs." XBitLabs.com (3/14) LinkedInFacebookTwitterEmail this Story
  • Corsair debuts DDR3 memory kits
    Corsair has introduced Vengeance Extreme dual-channel DDR3 memory kits, capable of storing 8 gigabytes of data and operating at 3 gigahertz. The memory kits will be available this month on the Corsair.com site, priced at $749.99. XBitLabs.com (3/14) LinkedInFacebookTwitterEmail this Story
  • Vendors unveil coherent optics with pluggable interfaces
    Investments in advanced coherent optical networking are beginning to pay off with the introduction this week of new pluggable transceiver modules for 100 Gbps architectures. Product announcements from Oclaro and Sumitomo Electric Device Innovations USA are paving the way for smaller, more energy-efficient optical interfaces and will create new opportunities for chipmakers such as AppliedMicro and ClariPhy Communications, observers say. Light Reading (3/13) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Clare offers set-up for flash testing of boards
    Clare has added an enclosure component to its HAL 104 test system that can accommodate a variety of unpopulated printed circuit boards for flash testing in initial production. The test checks for manufacturing defects and verifies whether the bare board complies with safety standards, according to the company. Electronics Weekly (U.K.) (3/15) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC welcomes new members to the Association
    JEDEC is the global leader in developing standards for the microelectronics industry, bringing together over 4,000 member company volunteers in 50 technical committees to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to the following new member companies: Compeq Manufacturing, Global Unichip Corporation, Mayo Clinic SPPDG Dept., National Instruments, Smart Storage Systems and SmartDV Technologies India. Interested in JEDEC membership for your company? Find out more and join today. LinkedInFacebookTwitterEmail this Story
  • Register now at the early-bird rate for JEDEC's Mobile Forum and save
    Early-bird rates end 3/22 so don't delay! Join us in Santa Clara, Calif., on 5/1 & 2 where industry leaders will focus on the latest developments and standards for mobile, including UFS, LPDDR3 & 4 and Wide I/O 2. Visit the JEDEC website for the complete agenda and registration. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

  SmartQuote 
Adventure is not outside man; it is within."
--George Eliot,
British writer


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