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January 31, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Databeans projects 7% growth for chipmakers this year
    The semiconductor market will expand 7% this year to $313.04 billion, Databeans says, and it foresees 9% annual growth between 2010 and 2018. Asia-Pacific and the U.S. are expected to see the strongest growth this year, the firm says. EE Times (1/30) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • GlobalFoundries said to start the paperwork on expanding Fab 8
    While Fab 8 isn't completed and operational, GlobalFoundries is going ahead with applying for permission to build a second module at the facility in Saratoga County, N.Y., according to the BusinessReview website. The $10 billion expansion is expected to be a 450-millimeter wafer fabrication plant. (1/29) LinkedInFacebookTwitterEmail this Story
  • Qualcomm's Q1 results top estimates; strong global demand seen
    Qualcomm outperformed analyst estimates on revenue and profit in its first quarter ended Dec. 30 and increased its revenue forecast for 2013 as the chipmaker said global demand for its smartphone processors is soaring, especially in emerging markets such as China and Latin America. "In general, the market is growing like crazy," Qualcomm President Steve Mollenkopf said. Qualcomm executives still cautioned that global economic uncertainty could dampen results this year. Reuters (1/30), CNET (1/30) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • EEMBC to craft new benchmark for ultra-low-power MCUs
    The Embedded Microprocessor Benchmark Consortium is developing a more comprehensive benchmark for ultra-low-power microcontrollers. EEMBC President Markus Levy said, "When these devices are in real low-power modes, it is not just about their execution times but how well they use sleep modes, how often they have to wake up processors and how much energy they waste." EE Times (1/30) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Freescale debuts 3 security coprocessors, targeting Cavium
    Freescale Semiconductor has introduced three parts in the C29x line of security coprocessors, hoping it can beat rival Cavium on price and performance, this article notes. The devices will ship in this quarter. "The security coprocessor space is a potentially high-margin market for Freescale," said Joseph Byrne of The Linley Group. EE Times (1/30) LinkedInFacebookTwitterEmail this Story
  • Xilinx sets 20nm chip tape-out for Q2
    Xilinx expects to tape out its first IC with 20-nanometer features in the second quarter of this year. The resulting chips will be both hardware- and software-programmable, the company says. Taiwan Semiconductor Manufacturing will fabricate the 20nm chips with its 20SoC process. EE Times (1/30) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Website claims to have benchmark test results of "Haswell" processor
    An engineering sample of Intel's forthcoming quad-core "Haswell" processor reportedly has been clocked at 2.80 gigahertz and can run faster than the Core i7-3770K, according to the website, which claims to have the first benchmark test results for the "Haswell" processor. The results have not been verified, however, this blog post notes. (1/30) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Last chance to save: online registration ends today for JEDEC's DDR4 Workshop
    Register now for JEDEC's two-day DDR4 Workshop on Feb. 6 and 7 in Santa Clara, Calif., offering an in-depth technical review of DDR4 as taught by industry leaders involved in the creation of the standard. Presenters include representatives from Agilent, AMD, Inphi, Intel, Micron, Montage, Samsung and SK Hynix. See the agenda and register now -- online registration and discounts end today. LinkedInFacebookTwitterEmail this Story
  • JEDEC Mobile Forum 2013 – call for presentations
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8. LinkedInFacebookTwitterEmail this Story
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