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February 6, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • GlobalFoundries: 14nm chips use less power than 28nm ICs
    GlobalFoundries reported it has been able to fabricate a dual-core processor with 14-nanometer features, based on the ARM Cortex-A9 design, with its 3D 14nm-XM FinFET transistors, and that the resulting chip is twice as energy-efficient as ICs made with its 28nm super-low-power process. (2/5) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Powertech chairman promises 2013 will be better
    Powertech Technology reported revenue rose 5.5% in 2012 to $1.41 billion, while net income declined 11.5% from 2011, as the IC assembly and test contractor had less business from DRAM suppliers. Chairman Tsai Du-kung apologized for not meeting the expectations of shareholders and said the company's business would improve in the second quarter. The Taipei Times (Taiwan) (2/6) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Silicone could replace copper in realizing photonic PCBs
    IBM has collaborated with Dow Corning Electronics to develop silicone that could function as the interconnect material in printed circuit boards, replacing copper and potentially providing a way to make fast, energy-efficient photonic interconnects. Dow Corning's Eric Peeters touted "silicone-based board-level interconnects that quickly supersede conventional electronic signal distribution methods." EE Times (2/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • IBM researchers aim for self-assembling carbon nanotube chips
    Scientists at IBM's Watson Research Center have been making progress on a goal to craft a high-density, self-assembling semiconductor device based on carbon nanotubes. The team has made a carbon nanotube chip with 150-nanometer dimensions, which although it doesn't seem much compared with the state of the art in silicon-based ICs, carbon nanotubes, in theory, promise to be faster and more energy-efficient than silicon transistors. (U.K.) (2/6) LinkedInFacebookTwitterEmail this Story
  • MediaTek adds app store to its smart-TV chipset
    MediaTek chipsets for Internet-connected televisions now include the Opera TV Store, a Web application outlet that can be used with media players, set-top boxes and smart TVs. The app developed by Opera Software is currently available on Sony's Bravia TV models and Blu-ray disc players. Broadband TV News (2/5) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • ARM CEO endorses ST's FD-SOI process technology
    ARM Holdings CEO Warren East praised the fully-depleted silicon-on-insulator process technology offered by STMicroelectronics and urged the chipmaker to make it more widely available. East said the physical intellectual property needed for FD-SOI "is essentially the same" as that for bulk complementary metal-oxide semiconductor processes. EE Times (2/5) LinkedInFacebookTwitterEmail this Story
  • AMD develops new overclocking tech, website claims
    Advanced Micro Devices is said to have developed OverDrive 6, a dynamic overclocking technology that could go into its AMD Radeon HD 8000 graphics cards, according to the techPowerUp website, which says the technology would help AMD better compete with graphics cards from Nvidia. AMD did not comment on the report. (2/5), (2/6) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC updates JESD99, a key reference standard
    JESD99C: Terms, Definitions, and Letter Symbols for Microelectronic Devices is now available for free download from the JEDEC website. The standard lists and defines more than 400 of the most common physical and electrical terms applicable to microelectronic devices and shows the industry-standard symbol and abbreviations that have been established for such terms. LinkedInFacebookTwitterEmail this Story
  • JEDEC Mobile Forum 2013 – call for presentations
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8. LinkedInFacebookTwitterEmail this Story
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