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November 19, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • Analysis: Can Renesas find a renaissance in the Wii U?
    Renesas Electronics seemingly has quite a bit riding on the success or failure of Nintendo's Wii U, since it may have a custom system-on-a-chip device and other parts in the new console, Junko Yoshida writes in this analysis. In the fiscal second quarter ended Sept. 30, Renesas reported a 20.6% sequential increase in SoC sales that may reflect increased graphics processing units made for Nintendo, she writes. EE Times (11/17) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • UMC reshuffles senior management ranks, names CEO
    Po-Wen Yen, the senior vice president for 300-millimeter operations at United Microelectronics, was named CEO of the silicon foundry, while his predecessor, Shih-Wei Sun, was tapped to serve as vice chairman of the company. "My top priority as CEO will be to ensure we meet customers' needs. In addition, I am eager to tackle upcoming challenges as UMC steers through industry and macroeconomic headwinds," Yen said in a statement. EE Times (11/19) LinkedInFacebookTwitterEmail this Story
  • New Apple products to boost suppliers' financials
    Advanced Semiconductor Engineering, Taiwan Semiconductor Manufacturing and other providers of manufacturing services to Apple are expected to show strong financial results in the first quarter of 2013 as Apple puts its new iPad and iPhone products into production, this article notes, citing market observers. Business for TSMC should pick up in March following seasonal slowness in the first two months of the year, while ASE is expected to assemble an increased volume of communications chips in the first quarter. DigiTimes (11/19) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Intel reportedly develops low-power Atom processor
    Intel is developing an Atom processor, code-named Briarwood, that will be available in the first quarter of 2013 for use in storage area networks and storage building blocks, CPU World reports. The low-power processor will have two Saltwell x86-architecture cores with Hyper-Threading Technology and virtualization support, according to the website. Intel didn't comment on the report. (11/16) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Researchers to develop "brain-on-a-chip" device with microfluidics
    Researchers at Draper Laboratory and the University of South Florida are collaborating on technology to emulate the human brain with embryonic cells from rats. Using microfluidics and other advanced technologies, the goal is to develop a "brain-on-a-chip" device for studying Alzheimer's disease and other neurodegenerative conditions, Mark LaPedus writes in this analysis. (11/15) LinkedInFacebookTwitterEmail this Story
  • NXP exec: Auto industry needs closer ties with IC industry
    The automotive industry and chip companies "need to collaborate more intensively" to realize the concept of the "connected car," Kurt Sievers of NXP Semiconductors says in this interview. The specific areas needing cross-industry collaboration are car-to-car communication, data security, Ethernet networking and near-field communication, he notes. EE Times India (free registration) (11/19) LinkedInFacebookTwitterEmail this Story
  • Samsung plans February unveiling of mobile app processor
    Samsung Electronics is scheduled to present details on an application processor for mobile devices, a 28-nanometer system-on-a-chip incorporating the "big.little" architecture created by ARM Holdings, at a conference in February. Kevin Krewell of The Linley Group said, "We expect the Samsung part is the first big.little processor. The A7 cores should be capable of handling most [smartphone] tasks, with the A15 cores only required for maximum performance needs, like video games." EE Times (11/19) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • TI ties Webench tool with leading EDA software
    The online Webench analog chip design tool from Texas Instruments now works with Altium Designer, OrCAD Capture CIS from Cadence Design Systems and DxDesigner from Mentor Graphics. "The engineer no longer needs to manually enter the design into the CAD platform, nor is there a need to worry about errors made in the process," Altium's Chris Donato said. Electronics Weekly (U.K.) (11/19) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Now is the time to join JEDEC for 2013
    As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: from components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today. LinkedInFacebookTwitterEmail this Story
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
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Nothing is too small to know, and nothing is too big to attempt."
--William Cornelius Van Horne,
Canadian railway executive

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