| News for and about the microelectronics industry |  |
| Today's Tech Buzz |  |  |
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- Small EDA firm brings patent complaints against LG, Nokia, others
Tela Innovations, a small but well-financed startup in electronic design automation software, has filed patent infringement complaints with the U.S. International Trade Commission and federal court in Delaware against HTC, LG Electronics, Motorola Mobility, Nokia and Pantech. Tela's financial backers include Cadence Design Systems, Intel Capital and Qualcomm. EE Times
(2/11)     
| ICs, Memory & More | | |
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- IC groups urge Congress to not cut basic R&D budgets
The Semiconductor Industry Association and the Semiconductor Research Corp. are urging Congress to not let drastic budget cuts hit federal agencies engaged in basic research and development. "Collaboration among industry, academia and government accelerates knowledge advancements, lowers risk and enables growth and innovation to continue for the benefit of industry and society as a whole. It represents a win-win-win," SRC President Larry Sumney said. Electronics Weekly (U.K.)
(2/11)
- University wants treble damages in patent suit against Marvell
Carnegie Mellon University wants a federal court to triple the damages of $1.17 billion it won in a patent infringement lawsuit against Marvell Technology Group. The university is also seeking to have the chip company pay $321 million in pre-judgment interest. The judge overseeing the case has scheduled a hearing for May 1. Reuters
(2/11)
- Samsung, Apple prepare for supply chain split
Apple and Samsung Electronics are preparing for a divorce in their supply-chain relationship, in which the iPhone maker has relied on Samsung for chips, displays and other components. Apple has found other suppliers such that its purchases now represent 3% of Samsung's bottom line, half the former total. Competition between the rivals has ratcheted sharply as Samsung has surpassed Apple in the global smartphone market and the companies have engaged in global courtroom battles over patents. Bloomberg
(2/12)
| Going Green | | |
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| Semiconductors in Action | | |
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- What the Internet of Things means for chipmakers
The Internet of Things could provide opportunities for semiconductor manufacturers in the areas of connectivity, control and sensing, Stacey Higginbotham notes in this analysis. "To build the Internet of Things we're going to need a lot of chips — orders of magnitude more than we have in use today," she writes. GigaOm
(2/11)
| Testing & Standards | | |
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- Flexible electronics to be featured in conference papers
Organic thin-film transistors, which can provide the basis for large-area flexible electronics, are the topics of three research papers to be presented at the International Solid-State Circuits Conference, which begins Sunday in San Francisco. "The prime application for these TFT families are backplanes for active-matrix displays, including in particular flexible displays," this article notes. ElectroIQ
(2/11)
| JEDEC News | | |
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JEDEC updates JESD99, a key reference standard
JESD99C: Terms, Definitions, and Letter Symbols for Microelectronic Devices is now available for free download from the JEDEC website. The standard lists and defines more than 400 of the most common physical and electrical terms applicable to microelectronic devices and shows the industry-standard symbol and abbreviations that have been established for such terms.
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JEDEC Mobile Forum: Save the dates
To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more.
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