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January 17, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • $10 billion a year is needed for IC capex, R&D, Intel exec says
    A leading-edge chipmaker will need to spend $104 billion over the next decade on capital expenditures and IC research and development in order to stay at the forefront in semiconductor manufacturing and technology, Intel's William Holt said at the 2012 Industry Strategy Symposium. The cost of not maintaining the leading edge is even higher, Holt estimated, at $302 billion over 10 years. (1/16), ElectroIQ (1/16) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Sources: Vendors jostle for smartphone chip orders in China
    Broadcom, MediaTek, Qualcomm and Spreadtrum Communications reportedly are competing to supply 1GHz processors for lower-end smartphones that will be sold by China Mobile, China Telecom and China United Network Communications, DigiTimes reports, citing Taiwan-based handset makers. Qualcomm's MSM7227A and MediaTek's MT6575 are gaining much of the potential business, those sources say. DigiTimes (1/17) LinkedInFacebookTwitterEmail this Story
  Going Green 
  • ARM talks energy-efficiency battle with Intel
    Reacting to the news at CES that Intel has scored smartphone design wins for its "Medfield" Atom processor with Lenovo and Motorola Mobility, ARM Holdings CEO Warren East was dismissive, this blog post notes. "Are they ever going to be the leaders in power efficiency? No, of course not," he said. East seems more concerned about getting ARM-based processors into Windows 8 laptops and tablet computers, according to this post. GigaOm (1/16) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Open-source NFC stack complies with Android 4.0
    Inside Secure is offering version 4.3.3 of its open-source near-field communication protocol stack for the Android 4.0 "Ice Cream Sandwich" mobile operating system. The company said the release complies with Android 4.0's Compatibility Definition Document for NFC. Electronics Weekly (U.K.) (1/17) LinkedInFacebookTwitterEmail this Story
  • Samsung says it will invest $41 billion in operations this year
    Samsung Group says it plans to spend $41.4 billion to expand its operations in 2012, with much of that sum expected to go toward production of logic semiconductors and OLED televisions at Samsung Electronics. Samsung may sell up to $1 billion in bonds to finance expansion of its facility in Austin, Texas, where it makes processor chips for Apple and memory devices. Reuters (1/17), Bloomberg (1/16) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • Post-holidays sales decline is seen for IC testing/packaging contractors
    The customary slow season for chip packaging and testing contractors comes in the first quarter of the year, and those contractors foresee a decline in revenues of 5% to 10% for this period, compared with the fourth quarter of last year. Advanced Semiconductor Engineering, one of the largest contractors, sees the sales lull extending into the second quarter, before picking up in the third quarter. The China Post (1/16) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC publishes breakthrough standard for Wide I/O Mobile DRAM
    Widely anticipated by the industry, the new standard is designed to meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices. JESD229: Wide I/O Single Data Rate is now available for free download from the JEDEC website. LinkedInFacebookTwitterEmail this Story
  • JEDEC standard for handling electrostatic-discharge-sensitive devices published
    JESD625B: Requirements for Handling Electrostatic-Discharge-Sensitive Devices is now available for free download from the JEDEC website. This standard establishes the minimum requirements for Electrostatic Discharge control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge. LinkedInFacebookTwitterEmail this Story
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Experience is a good teacher, but she sends in terrific bills."
--Minna Antrim,
American writer

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