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March 1, 2013
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  Today's Tech Buzz 
  • Conexant has pre-packaged Chapter 11 filing
    Conexant Systems filed Thursday for Chapter 11 protection from creditors, blaming its financial woes on weakness in the semiconductor market and an accumulation of "dead leases" for real estate. In the pre-arranged filing, the chipmaker will receive debtor-in-possession financing of $15 million from QP SFM Capital Holdings, which plans to convert about $195 million in secured debt it holds in Conexant into equity of the reorganized company. Reuters (2/28) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Tokyo court OKs $2.2B merger of Micron and Elpida
    The Tokyo District Court gave its approval to Micron Technology's $2.2 billion acquisition of Elpida Memory after a majority of Elpida creditors voted for the takeover. The Japanese court is expected to make its approval order final this month, and the proposed acquisition awaits clearance from the U.S. Bankruptcy Court in Delaware. Bloomberg (2/28), Reuters (2/28) LinkedInFacebookTwitterEmail this Story
  • Phison chairman: Demand is falling for NAND flash controllers
    With feature phones losing global market share to smartphones, the market for NAND flash controller chips is expected to decline, Phison Electronics Chairman Khein Seng Pua said. The market for microSD cards is shifting to embedded multimedia cards, he noted, while flash-based solid-state drives are also emerging as an opportunity for NAND flash memory. DigiTimes (3/1) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  Semiconductors in Action 
  • Freescale develops ARM-based MCU that could be swallowed
    Freescale Semiconductor has introduced the Kinetis KL02 microcontroller, a chip small enough to be digested by humans for biodevice applications, this article notes. Based on an ARM Holdings design, the chip is meant for use in the Internet of Things, according to Freescale's Steve Tateosian. TechEye.net (2/28) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Other News
  JEDEC News 
  • JEDEC Mobile Forum: Save the dates
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more. LinkedInFacebookTwitterEmail this Story
  • JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
    JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
Mediocrity knows nothing higher than itself, but talent instantly recognizes genius."
--Sir Arthur Conan Doyle,
Scottish-born writer


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