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February 8, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • It's official: Fujitsu and Panasonic plan IC joint venture
    The rumored semiconductor joint venture between Fujitsu and Panasonic will come to fruition under a Fujitsu restructuring that includes the elimination of 5,000 jobs. Fujitsu President Masami Yamamoto said the company may also relocate a wafer fabrication line in Japan's Mie prefecture and is in negotiations with Taiwan Semiconductor Manufacturing about foundry services. "Fujitsu will still have the burden of bringing the new joint venture to profitability, and we do not expect profit growth commensurate with the staff reductions," Goldman Sachs Group analysts said in a report to investors. Bloomberg (2/8), XBitLabs.com (2/7) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • Analysts are expecting better results from ON Semi in 2013
    Industry analysts are looking for ON Semiconductor to improve its financial performance this year after the challenging conditions the chipmaker faced in 2012. "This is encouraging as chip investors look for signs of a cyclical recovery, inventory restocking and any signs of the next upturn," Craig Berger of FBR Capital Markets wrote of the company's fourth-quarter results. EE Times (2/7) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Low-power chips for servers are the way to go, AppliedMicro says
    Low-power processors for servers going into cloud data centers could represent half of Applied Micro Circuits' revenue by 2016, according to Chief Financial Officer Robert Gargus. Amazon, Facebook, Google and other companies are seeking servers that use less power, this article notes. Reuters (2/7) LinkedInFacebookTwitterEmail this Story
  • Ikon Semi debuts chip for LED lighting applications
    Ikon Semiconductor has introduced the IKS2053, which it says is smaller and more reliable than other chips for lighting applications with light-emitting diodes. The new Ikon chip doesn't need an electrolytic capacitor and optocouplers when used in LED modules, the company says. "Today, lighting accounts for nearly 20% of the world's electricity consumption," said Ikon CEO Conor McAuliffe, adding, "Largely driven by global legislation, inefficient legacy bulbs are steadily being replaced by energy-efficient lighting sources. LED lighting is the dominant replacement technology." Silicon Republic (Ireland) (2/7) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • Smartphones could have power to see through things with T-ray chips
    A professor at the California Institute of Technology has developed ICs that use terahertz waves to look through plastic, wood and other materials. The T-ray chips could possibly be used in smartphones for such work as detecting security threats in packages moving through the post office. The technology does come with some privacy issues, however. Bloomberg Businessweek (2/7) LinkedInFacebookTwitterEmail this Story
  • Firm offers wireless IC for M2M applications
    Redpine Signals has introduced the RS9113 M2MCombo chip, which supports dual-band 802.11n Wi-Fi, dual-mode Bluetooth 4.0 and ZigBee wireless connectivity. Aiming the IC at applications in machine-to-machine communications, the company is offering a development environment and a reference design for the chip. Techworld (U.K.) (2/7) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  • NAND flash memory module from Toshiba has a UFS interface
    Toshiba is making available a 64-gigabit embedded NAND flash memory module with a Universal Flash Storage interface, which it says complies with the JEDEC UFS 1.1 standard. Now in sampling, the module is targeted for use in tablet computers, smartphones and other digital consumer electronics devices. XBitLabs.com (2/7) LinkedInFacebookTwitterEmail this Story
  • Micron will add NAND flash to DRAM modules for DDR4 buses
    Micron Technology intends include NAND flash memory devices with DRAMs in memory modules to be used on the DDR4 bus, which is slated for delivery in the next 18 months. Such hybrid dual-inline memory modules would support both Linux and Windows, this article notes. EE Times (2/7) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Updates to JESD21-C: JEDEC Configurations for Solid State Memories now available for free download
    JESD21-C is a compilation of some 3000 of JEDEC memory device standards for solid state memory from September 1989 to the present. In addition to the free downloads available on the JEDEC website, an annual updating service and complete hard copies are also available for purchase. LinkedInFacebookTwitterEmail this Story
  • JEDEC updates JESD99, a key reference standard
    JESD99C: Terms, Definitions, and Letter Symbols for Microelectronic Devices is now available for free download from the JEDEC website. The standard lists and defines more than 400 of the most common physical and electrical terms applicable to microelectronic devices and shows the industry-standard symbol and abbreviations that have been established for such terms. LinkedInFacebookTwitterEmail this Story
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  SmartQuote 
If you want to make enemies, try to change something."
--Woodrow Wilson,
28th U.S. president


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