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February 27, 2013
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • ARM signs up 7 chip companies for power-saving architecture
    CSR, Fujitsu Semiconductor, MediaTek, Renesas Mobile, Samsung Electronics and two other companies have licensed the Big.Little chip architecture of ARM Holdings and will use it to reduce power consumption in their semiconductors, according to ARM. Under the Big.Little architecture, processing chores on a chip are parceled out to different cores, with simpler tasks assigned to a core, such as ARM's Cortex-A7, that needs less power to do its work. Computerworld/IDG News Service (2/26) LinkedInFacebookTwitterEmail this Story
Breakthru DDR/LPDDR analysis for both controllers & ICs
New Memory Compliance Analyzer integrates realtime protocol analysis with logic analysis to realize a breakthrough instrument for DDR and LPDDR memory systems. The innovative dual-instrument combination enables memory controller performance monitoring as well as state of the art real-time DDR and LPDDR protocol violation detection. Learn more here.
  ICs, Memory & More 
  • ST's Vigna: MEMS will still draw in wireless business
    Although STMicroelectronics plans to withdraw from its wireless IC joint venture with Ericsson, the chipmaker will continue to get orders from Apple and Samsung Electronics for imaging and sensor microelectromechanical systems used in mobile devices, ST's Benedetto Vigna says. ST expects its imaging and sensor MEMS sales to increase faster than the 19% annual growth predicted for the overall market in the next three years, he adds. Bloomberg (2/27) LinkedInFacebookTwitterEmail this Story
  • Sources: TLC flash memories are getting harder to procure
    As suppliers of NAND flash memory devices devote more resources to making multi-level cell NAND flash memory, triple-level cell NAND flash is proving harder to get, DigiTimes reports, citing industry sources. TLC NAND flash is chiefly used in flash memory cards and drives, while MLC NAND flash goes into embedded multimedia cards and embedded storage devices. Some semiconductor distributors have stopped quoting prices for TLC NAND flash, sources at downstream memory makers say. DigiTimes (2/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Intel debuts 4G/LTE modem platform for mobile devices
    Intel has introduced the XMM 7160 modem platform, which supports 15 4G and Long-Term Evolution wireless bands. A single-mode version of the 4G/LTE platform is now shipping, with a multimode version expected to hit the market between by June. (2/25) LinkedInFacebookTwitterEmail this Story
  Semiconductors in Action 
  • JPMorgan: TSMC makes processors for Samsung's Galaxy S4
    Samsung Electronics is expected to use Qualcomm's quad-core Snapdragon 600 processor for the U.S. version of its new Galaxy S4 smartphone, according to JPMorgan Securities. Taiwan Semiconductor Manufacturing makes the Snapdragon 600 with a 28-nanometer process, the brokerage firm noted. "We see Samsung's switch to Qualcomm for its U.S. shipments as positive for the semiconductor sector," wrote JPMorgan's Rick Hsu. The Taipei Times (Taiwan) (2/27) LinkedInFacebookTwitterEmail this Story
  • Qualcomm, MediaTek put off 8-core processors, sources say
    Qualcomm and MediaTek are not proceeding with development of eight-core processors for mobile devices, DigiTimes reports, citing industry sources. Only Samsung Electronics is going ahead with an eight-core processor for mobile devices, those sources noted. Meanwhile, MediaTek President Hsieh Ching-chiang said the company this quarter plans to introduce its MT6572 processor for smartphones and to debut its MT8135 processor for tablet computers in the next quarter. DigiTimes (2/27), DigiTimes (2/26) LinkedInFacebookTwitterEmail this Story
  • Other News
  Testing & Standards 
  JEDEC News 
  • JEDEC Mobile Forum: Save the dates
    To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Online registration coming soon! Find out more. LinkedInFacebookTwitterEmail this Story
  • JEDEC members among UBM Tech's Test & Measurement World 2013 Best in Test Winners
    JEDEC congratulates member companies Agilent Technologies, Mentor Graphics, National Instruments, Synopsys and Tektronix on their selection as "2013 Best in Test" winners by Test & Measurement World. The awards honor innovations from 2012 that are considered by editors and readers to have made important contributions to the industry. LinkedInFacebookTwitterEmail this Story
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If you want to truly understand something, try to change it."
--Kurt Lewin,
German-American psychologist

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