Reading this on a mobile device? Try our optimized mobile version here:

March 14, 2013
Sign upForwardArchiveAdvertise
News for and about the microelectronics industry

  Today's Tech Buzz 
  • Sources: Apple's A7 chip will be taped out this month by TSMC
    Apple's latest custom processor for its mobile devices, the A7, will reportedly be taped out this month by Taiwan Semiconductor Manufacturing in preparation for initial production this spring, DigiTimes reports, citing industry sources. The chip is expected to go into volume production in the first quarter of 2014, those sources say. TSMC declined to comment on the report. Sources familiar with TSMC's plans told CNET that the foundry will fabricate the A7 with a 20-nanometer process. CNET (3/14), DigiTimes (3/13) LinkedInFacebookTwitterEmail this Story
Free Memory Webcasts
Every generational change of memory standards puts new risks in your path. We see it firsthand when creating our products and working with engineers like you. Agilent’s broad memory expertise is built on our ongoing involvement with JEDEC. By sharing this expertise, in this webcast series, we can help you anticipate your next design challenges.
  ICs, Memory & More 
  • IHS iSuppli: Chip inventories shrank 5% in Q4
    During the fourth quarter, semiconductor suppliers reduced their days of inventory by 5% compared with the third quarter, according to IHS iSuppli. Intel was particularly efficient in getting chip inventory out the door, reducing its hoard by $585 million or 11%, the market research firm estimated. "Semiconductor companies reduced their inventories at a faster-than-expected rate in the fourth quarter as they moved to adjust to weakening demand," IHS iSuppli's Sharon Stiefel said. Total Telecom Magazine (U.K.)/Dow Jones Newswires (3/13) LinkedInFacebookTwitterEmail this Story
  • China's IC industry depends on foreign equipment, materials
    The semiconductor industry in China, which supplies less than 10% of the chips needed by the country's electronics manufacturers, has to import $160 billion in semiconductor production equipment and materials each year to keep up with demand, the Xinhua news agency reports. ZDNet (Asia) (3/13) LinkedInFacebookTwitterEmail this Story
  • UMC sets sale of 1.3 billion shares to industry partners
    The board of United Microelectronics has approved a private placement of 1.3 billion new shares of common stock in the silicon foundry. "The private placement is to help create an opportunity for semiconductor technology cooperation, or to form a strategic alliance with local or foreign companies," spokesman Liu Chitung wrote in a filing with the Taiwan Stock Exchange. The Taipei Times (Taiwan) (3/14) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Speakers: MEMS devices could be used in energy harvesting
    Panelists at a conference in Amsterdam speculated on how microelectromechanical system devices could be implemented in energy-harvesting applications. MEMS devices can offer real-time data on power consumption and predict consumption trends, according to Wim Sinke of the Energy Research Center of the Netherlands. (3/13) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • Toshiba offers SSDs made with 19nm MLC NAND flash
    Toshiba is shipping its THNSNH line of solid-state drives, which it says incorporate multi-level cell NAND flash memory devices made with a 19-nanometer process. The SSDs are intended for all-in-one desktop PCs, high-end notebook computers and industrial systems, according to the company. Toshiba also reported that its TMPM4440 microcontrollers, based on the Cortex-M4 design from ARM Holdings, now feature digital signal processor extensions, a floating-point unit and a programmable servo/sequencer controller. (3/13), Electronics Weekly (U.K.) (3/14) LinkedInFacebookTwitterEmail this Story
  • Lattice debuts 40nm FPGA
    Lattice Semiconductor has introduced the LP384 chip, the latest in its iCE40 line of field-programmable gate arrays. The parts are fabricated with a 40-nanometer process. Each chip includes 384 logic cells, according to Lattice. Electronics Weekly (U.K.) (3/13) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Altis is tapped by IBM Micro to use RF SOI process
    Altis Semiconductor will use a 180-nanometer silicon on insulator manufacturing process developed by IBM Microelectronics to fabricate radio-frequency chipsets for mobile devices, this article notes. With IBM's 7RFSOI process, Altis aims to offer IC foundry services for such parts in 2014. EE Times (3/13) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • Register today for the 28th annual ROCS (Reliability of Compound Semiconductors) Workshop
    Join us on May 13 in New Orleans, La., where the ROCS Workshop will once again be held with the CS MANTECH conference; bringing together researchers, manufacturers and users of compound semiconductor devices. Visit the event website or register now -- online registration and discounts end April 29 and space is limited, so don't delay! LinkedInFacebookTwitterEmail this Story
  • Online registration is now open for JEDEC's Mobile Forum 2013
    Register today to reserve your spot in Santa Clara, Calif., on 5/1 & 5/2 to examine the industry's latest memory and storage-related advancements & new standards enabling applications and impacting mobile devices such as smartphones and tablets. Space is very limited -- see the agenda and REGISTER NOW for the Mobile Forum. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

Success is a lousy teacher. It seduces smart people into thinking they can't lose."
--Bill Gates,
American businessman

LinkedInFacebookTwitterEmail this Story

Subscriber Tools
Print friendly format | Web version | Search past news | Archive | Privacy policy

Account Director:  Roger Leek (804) 803-1414
A powerful website for SmartBrief readers including:
 Recent JEDEC SmartBrief Issues:   Lead Editor:  Susan Rush
Contributing Editor:  Jeff Dorsch
Mailing Address:
SmartBrief, Inc.®, 555 11th ST NW, Suite 600, Washington, DC 20004
© 1999-2013 SmartBrief, Inc.® Legal Information