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December 12, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  • MediaTek debuts quad-core SoC for high-end smartphones
    MediaTek has introduced the MT6589 quad-core system-on-a-chip processor, made with a 28-nanometer process and intended for use in high-end smartphones. The IC design firm hopes the chip will help it better compete with Qualcomm in the world market for advanced mobile processors. The Register (U.K.) (12/12) LinkedInFacebookTwitterEmail this Story
  ICs, Memory & More 
  • SEMI: Taiwan leads Q3 spending on IC production equipment
    Taiwan Semiconductor Manufacturing and other chipmakers in Taiwan increased their spending on semiconductor production equipment to $2.34 billion during the third quarter, a 58% boost from the same period in 2011, according to Semiconductor Equipment and Materials International. Compared with the $3.25 billion Taiwanese chipmakers spent on production gear in the second quarter, Q3 expenditures were down 28%, SEMI noted. The Taipei Times (Taiwan) (12/12) LinkedInFacebookTwitterEmail this Story
  • Europe must do more to attract fabs, GlobalFoundries CEO says
    European governments must provide more financial incentives if they want to have semiconductor companies build wafer fabrication plants on the continent, according to GlobalFoundries CEO Ajit Manocha. "This is a competitive world. If I go to Asia, they'll roll out the red carpet for us; they'll do lots of subsidies. The state of New York does a good job," he said Tuesday in San Francisco. "Europe is not playing that role properly." Reuters (12/11) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • Facebook endorses Intel's new processor but may not buy it
    Intel on Tuesday introduced the low-power Atom S1200 processor, designed to be used in microservers. While Facebook executive Frank Frankovsky spoke at Intel's press conference for the chip, he didn't say whether the social network would be using the new processor in the servers of its data centers. A Facebook spokesman said, "Based on how it looks on paper it doesn't look like it meets the needs of our workloads." Reuters (12/11), GigaOm (12/11) LinkedInFacebookTwitterEmail this Story
  • Qualcomm CEO: Smartphones still have growth potential
    The smartphone is not yet fully mature, according to Qualcomm CEO Paul Jacobs, who notes that 39% of mobile phones shipped this year were smartphones. "There's about 1.9 billion mobile broadband connections and there's six billion connections overall. So there's still a huge place to go in terms of growth for mobile broadband, which is really the fundamental enabling technology for smartphones," he says in this interview. The Wall Street Journal (12/11) LinkedInFacebookTwitterEmail this Story
  • Broadcom packs Bluetooth, FM, NFC, Wi-Fi into one radio chip
    Broadcom has introduced the BCM43341 radio chip for mobile devices, which will be featured at next month's International CES exhibition. The chip integrates Bluetooth, FM radio, near-field communication and Wi-Fi connectivity in one part. Customers are sampling the BCM43341, which will go into volume production in the first quarter of 2013. Computerworld (12/11), VentureBeat (12/11) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Industry debates use of FinFETs, fully depleted SOI
    STMicroelectronics chose fully depleted silicon-on-insulator technology over FinFETs in designing its 28-nanometer semiconductors, Ed Sperling notes. The resulting chips are faster and use less power than those made with a bulk complementary metal-oxide semiconductor process, according to ST. (12/11) LinkedInFacebookTwitterEmail this Story
  • Other News
  JEDEC News 
  • Back by popular demand: JEDEC to hold DDR4 Workshop in February 2013
    Join us in Santa Clara, Calif., on Feb. 6 and 7 for an in-depth technical review of DDR4, as taught by industry experts involved in the creation of the standard. Participants will gain insight into DDR4's wide range of innovative features and device operation, as well as current and planned technological enablements to facilitate adoption of DDR4. See the agenda and register today -- space is very limited and early bird discounts end 12/21. LinkedInFacebookTwitterEmail this Story
  • EE Times takes a first look at JESD230 NAND Flash interface interoperability standard
    JEDEC and ONFI talk with EE Times Memory Designline editor Kristin Lewotsky in this informative Q-and-A about JESD230. The standard is available for free download from both and LinkedInFacebookTwitterEmail this Story
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Thinking is like loving and dying. Each of us must do it for himself."
--Josiah Royce,
American philosopher

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