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January 21, 2013

News for and about the microelectronics industry

Today's Tech Buzz

Intel to fabricate 14nm chips at Ariz. fab by end of 2013
Intel's Fab 42 in Chandler, Ariz., is installing new production equipment and will begin making semiconductors with 14-nanometer features by the end of 2013, Intel executives reported. The chipmaker last year said that two other facilities, in Ireland and Oregon, would also produce 14nm chips, but it didn't give an update on the timetable for those facilities. MIT Technology Review online (1/21), XBitLabs.com (1/18)

ICs, Memory & More

Analysis: Qualcomm-Samsung ties may fray over logic ICs
As Samsung Electronics boosts its output of logic chips, it may purchase fewer logic ICs from Qualcomm for its products, Kim Yoo-chul notes in this analysis. "Our idea is to use Samsung solutions for Samsung products. That will be the base of our profitability for the future," an unnamed Samsung official said. "Yes, we are trying to cut our dependence on Qualcomm for logic chips, although we are producing some of its logic chips on a foundry basis." Credit Suisse told clients in a letter, "The logic chip business has the greatest potential to become another Samsung growth engine." The Korea Times (Seoul) (1/20)

Deutsche Bank sees good times for TSMC with mobile chips
Deutsche Bank sees higher profits for Taiwan Semiconductor Manufacturing this year and in 2014 due to increased demand for chips made with 28-nanometer and 20nm features, which often go into mobile devices. "We forecast TSMC's increased dominance and growing addressable markets in 28/20 nanometers to drive stronger earnings growth," analyst Michael Chou said. The bank rates TSMC's stock as a "buy." The Taipei Times (Taiwan) (1/21)

Going Green

Researchers: Nanotech could make solar cells cheaper, more efficient
Researchers at Sweden's Lund University have been able to produce solar cells with indium phosphide nanowires that demonstrate an energy efficiency of 13.8%. With millions of nanowires on the surface of a solar cell, those cells could be more energy-efficient and less expensive than silicon-based solar cells, the researchers say. Yahoo/Asian News International (1/19)

Semiconductors in Action

ST's set-top box chipsets win security certification
STMicroelectronics reported Conax has certified its Liege set-top box chipsets to operate securely in Internet-connected television sets and other home electronics. ST makes the STB chips with a 40-nanometer process. Electronics Weekly (U.K.) (1/21)

Violin Memory acquires GridIron Systems to accelerate apps
Violin Memory today announced it has acquired GridIron Systems, a developer of application acceleration technology for data centers. Financial terms weren't disclosed. Violin will integrate GridIron's technology into its flash memory-based arrays for Big Data analytics, data warehouses, online transaction processing and virtualization. Network World/IDG News Service (1/18)

Testing & Standards

Molecular Imprints says its litho tool can work with 450mm wafers
Molecular Imprints said an unnamed customer has accepted its Imprio 450 lithography system and will be using the tool to develop fabrication processes with 450-millimeter wafers. EE Times (1/18)

Soft-core processors may be optimal for embedded systems
The soft-core processors found in many field-programmable gate arrays may be the best design choice for embedded electronics, Sven-Ake Andersson of Realtime Embedded writes in this technical article. He examines four potential processors to use in the FPGA design project. EE Times Asia (free registration) (1/21)

JEDEC News

Looking for expert insights into the new DDR4 standard?
Register now for JEDEC's 2-day DDR4 Workshop on Feb. 6 and 7 in Santa Clara, Calif., offering an in-depth technical review of DDR4 as taught by industry leaders involved in the creation of the standard. Presenters include representatives from Agilent, AMD, Inphi, Intel, Micron, Montage, Samsung and SK Hynix. See the agenda and register today -- online registration and discounts end 1/31.

JEDEC Mobile Forum 2013 -- call for presentations
To be held in Santa Clara, Calif., on May 1 and 2, the Forum will focus on the latest developments and standards for mobile storage technology, including Universal Flash Storage (UFS), LPDDR3 & 4, and Wide I/O 2, as well as the mobile devices that utilize these standards, including smartphones, ultra-thin notebooks, and tablets. Share your knowledge and experience by submitting a presentation for consideration. All submissions due 2/8.

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