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November 8, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  ICs, Memory & More 
  • Diablo Tech raises $28M in recapitalization
    Diablo Technologies received $28 million in private investment to develop processor and memory technology on a single chip with the aim of improving performance in the data center. The effort will involve semiconductor intellectual property, software and systems technology, this blog post notes. Battery Ventures led the round, with participation by BDC Venture Capital, Celtic House Venture Partners and Hasso Plattner Ventures. GigaOm (11/7) LinkedInFacebookTwitterEmail this Story
  • IC Insights: GlobalFoundries breaks into top 20 list of chipmakers
    GlobalFoundries this year moved up from 21st place to 15th in IC Insights' ranking of worldwide semiconductor sales leaders, increasing its revenue by 31% from 2011. Qualcomm will boost its IC sales by 30% in 2012, the market research firm estimates, placing fourth this year, compared with seventh place in 2011. EE Times (11/8) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Analysts: Samsung is moving into low-power server chip market
    Licensing the Cortex-A57 and Cortex-A53 designs from ARM Holdings indicates that Samsung Electronics is likely targeting the market for 64-bit processors going into low-power servers, according to analysts. "The tea leaves are very much aligned to Samsung doing something around ARM in servers," said Nathan Brookwood of Insight 64. Samsung did not comment on its plans. Network World/IDG News Service (11/7) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • ST offers chipset to provide longer battery life in LTE handsets
    STMicroelectronics has updated its ParaScan Tunable Integrated Capacitors to offer longer battery life in smartphones operating on Long-Term Evolution wireless networks. "Two of the world's top five handset manufacturers have already chosen this technology for antenna matching in their current handsets," ST's Ricardo De-Sa-Earp said in a statement. (11/8) LinkedInFacebookTwitterEmail this Story
  • "Natural battery" in the human ear could power devices
    The inner ear contains a natural battery that could be used to power an electronic device, according to researchers at the Massachusetts Institute of Technology, the Massachusetts Eye and Ear Infirmary and the Harvard-MIT Division of Health Sciences and Technology. "We have known for 60 years that this battery exists and that it's really important for normal hearing, but nobody has attempted to use this battery to power useful electronics," said Konstantina Stankovic, an otologic surgeon at the infirmary. CNET/Cutting Edge blog (11/7) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Intel co-founder's genome is sequenced by chip-based product
    Gordon Moore, the co-founder of Intel, has had his personal genome sequenced by Ion Torrent Systems with a semiconductor sequencer that required more than 1,000 chips to carry out the analysis, R. Colin Johnson notes in this article. Thanks to Moore's Law, such sequencing could be done with a single chip in 12 years, he writes. EE Times Asia (free registration) (11/8) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC and ONFI publish NAND flash interface interoperability standard
    JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both and LinkedInFacebookTwitterEmail this Story
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
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