Reading this on a mobile device? Try our optimized mobile version here:

March 6, 2013
Sign upForwardArchiveAdvertise
News for and about the microelectronics industry

  Today's Tech Buzz 
  • Facebook: Goodbye, DRAM; hello, McDipper
    To reduce its dependence on dynamic random-access memory chips, Facebook has developed McDipper, a data cache based on NAND flash memory devices. "Compared with memory, flash provides up to 20 times the capacity per server and still supports tens of thousands of operations per second," the company stated Tuesday on its Facebook Engineering page. The social network has been using the McDipper memcache technology for about a year. GigaOm (3/5) LinkedInFacebookTwitterEmail this Story
Free Memory Webcasts
Every generational change of memory standards puts new risks in your path. We see it firsthand when creating our products and working with engineers like you. Agilent’s broad memory expertise is built on our ongoing involvement with JEDEC. By sharing this expertise, in this webcast series, we can help you anticipate your next design challenges.
  ICs, Memory & More 
  • Sources: MediaTek seeks "conditional approval" for MStar merger
    MediaTek is hoping to win "conditional approval" from Chinese and Korean regulators for its proposed merger with MStar Semiconductor, DigiTimes reports, citing industry sources. Even as they wait for the green light from those two governments, the companies reportedly have already begun to merge some of their operations, those sources said. DigiTimes (3/5) LinkedInFacebookTwitterEmail this Story
  • IHS iSuppli: Cloud storage is reducing demand for NAND flash
    Manufacturers of mobile devices are using fewer NAND flash memory chips because of the increasing use of cloud-based data storage and streaming media, according to IHS iSuppli. The market research firm found that cellphones this year have an average memory capacity of 12.8 gigabytes, compared with 13.2GB in the first six months of 2012. It added, "From the first half of 2011 to the same time one year later, flash memory loading in tablets dipped 25% from 32.1GB to 24.0GB on average." PC Magazine (3/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • UCLA researchers tout graphene supercapacitors
    University of California at Los Angeles researchers report they have developed electrochemical supercapacitors with the graphene material. "Our study demonstrates that our new graphene-based supercapacitors store as much charge as conventional batteries, but can be charged and discharged a hundred to a thousand times faster," UCLA professor Richard Kaner said. Electronics Weekly (U.K.) (3/5) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • Renesas to collaborate with Elektrobit for infotainment systems
    Renesas Electronics is working with Elektrobit to offer an integrated platform for infotainment systems in automotive vehicles. Renesas is contributing its R-Car H1 system-on-a-chip device, a quad-core processor based on the ARM Cortex-A9 design, to the effort, this article notes. EE Times (3/5) LinkedInFacebookTwitterEmail this Story
  • Intel lands socket in ZTE phone with new Atom Z2580 processor
    Intel worked with ZTE to develop the new Atom Z2580, a dual-core "Clover Trail+" processor that will go into a future smartphone model. The Chinese handset manufacturer, which is the world's fourth-largest supplier of mobile phones, is also choosing Nvidia's Tegra 4 processor for other smartphones. GigaOm (3/5), Digital Trends (3/5) LinkedInFacebookTwitterEmail this Story
Online registration is now open for JEDEC's Mobile Forum 2013!
Register today to reserve your spot in Santa Clara, CA on 5/1 & 2 to examine the industry's latest memory and storage-related advancements & new standards enabling applications and impacting mobile devices such as smartphones and tablets. Space is very limited — see the agenda and REGISTER NOW for the Mobile Forum.
  Testing & Standards 
  • GainSpan develops RFIC supporting both Wi-Fi and ZigBee
    GainSpan has introduced the GS2000, a baseband processor and radio-frequency IC on a single chip that supports the IEEE 802.11b/g/n and IEEE 802.15.4 wireless standards. The chip is fabricated by Taiwan Semiconductor Manufacturing with a 65-nanometer process. EE Times (3/5) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC elects two new members to its Board of Directors
    JEDEC is pleased to announce that Qualcomm and SK Hynix have been appointed to its Board of Directors. Qualcomm will be represented by Mr. Hung Vuong, and SK Hynix by Mr. Jong H. Oh. Both bring a wealth of experience in the memory and mobile industries to their role as board members. Read more. LinkedInFacebookTwitterEmail this Story
  • Register now at the early bird rate for JEDEC's Mobile Forum and save
    Early bird rates end 3/22 so don't delay! Join us in Santa Clara, Calif., on 5/1 & 5/2 where industry leaders will focus on the latest developments and standards for mobile, including UFS, LPDDR3 & 4 and Wide I/O 2. Visit the JEDEC website for the complete agenda and registration. LinkedInFacebookTwitterEmail this Story
Learn more about JEDEC ->Join JEDEC  |  Free Standards Download  |  Events & Meetings  |  News  |  Contact Us

Every time you spend money, you're casting a vote for the kind of world you want."
--Anna Lappé,
American writer, speaker and activist

LinkedInFacebookTwitterEmail this Story

Subscriber Tools
Print friendly format | Web version | Search past news | Archive | Privacy policy

Account Director:  Roger Leek (804) 803-1414
A powerful website for SmartBrief readers including:
 Recent JEDEC SmartBrief Issues:   Lead Editor:  Susan Rush
Contributing Editor:  Jeff Dorsch
Mailing Address:
SmartBrief, Inc.®, 555 11th ST NW, Suite 600, Washington, DC 20004
© 1999-2013 SmartBrief, Inc.® Legal Information