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November 9, 2012
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News for and about the microelectronics industry

  Today's Tech Buzz 
  ICs, Memory & More 
  • Buyers are passing up cheap PCs to get tablets, Nvidia CEO says
    As tablet computers become more advanced, people are becoming more attracted to them than cheaper PCs, Nvidia CEO Jen-Hsun Huang says. "These days, tablets are so versatile, transformable. Now with Microsoft Surface and Windows RT, the distinction between a tablet and a cheap notebook has all but disappeared. ... The future of cheap PCs is tablets," Huang said. Nvidia said its net income in the quarter ended Oct. 28 was $209.1 million, compared with $178.3 million in the year-ago quarter, as revenue increased 13% to $1.2 billion. CNET (11/8), Bloomberg Businessweek (11/9) LinkedInFacebookTwitterEmail this Story
  • Other News
  Going Green 
  • Toshiba debuts battery monitor chipset for HEVs
    Toshiba Electronics has introduced the TB9141FG battery monitor chip, which, when paired with the TMPM358FDTFG ARM Cortex-M32 microcontroller, forms a chipset that can keep tabs on up to 16 cells in the lithium-ion batteries of hybrid electric vehicles, it was said. Toshiba plans to sample the chipset in February, followed by volume production in April 2014. Electronics Weekly (U.K.) (11/8) LinkedInFacebookTwitterEmail this Story
  • Other News
  Semiconductors in Action 
  • NFC tech makes toys more interactive
    Near-field communication technology, generally used in smartphones to enable mobile payments, is being adopted for a wider variety of applications, according to this survey. The popular Skylanders video games from Activision have an associated line of action figures that can be incorporated into game play through NFC tags and NFC reader/writers, for example. EE Times (11/8) LinkedInFacebookTwitterEmail this Story
  • AMD slashes price tags for desktop processors
    Advanced Micro Devices has reduced prices on Athlon II central processing units and previous-generation Fusion A-Series accelerated processing units. In the case of Fusion A-Series APUs, prices have gone down by 4.4% to 21.6%, this blog post notes. Athlon II processors are now 14.5% to 31.6% cheaper. (11/8) LinkedInFacebookTwitterEmail this Story
  Testing & Standards 
  • Moore's Law gets a boost from fully depleted SOI technology
    STMicroelectronics has developed a 28-nanometer complementary metal-oxide semiconductor process with fully depleted silicon-on-insulator technology, Paul Whytock writes in this blog post. The process is being shared with other parties under France's Circuits Multi-Projet program. "FD-SOI will help maintain Moore's Law by making it easier to fit semiconductor devices into smaller pitches, which in turn increases logic density that helps keep the Law rolling forward," he notes. Electronic Design (11/8) LinkedInFacebookTwitterEmail this Story
  • Startup uses porous metal to keep chips, servers cooler
    Versarien, working in conjunction with researchers at the University of Liverpool, has developed a porous metal material that is said to promote better thermal management in electronic components and other products. The technology involves a method called lost carbonate sintering, which is patented. EE Times (11/8) LinkedInFacebookTwitterEmail this Story
  JEDEC News 
  • JEDEC and ONFI publish NAND flash interface interoperability standard
    JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both and LinkedInFacebookTwitterEmail this Story
  • Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download
    JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase. Recent updates include: SO-018A (DDR4 and GDDR5M SODIMM), SO-008B (DDR1/DDR2/DDR3, 144 Pin, 16b/32b SODIMM), MO-274B, and MO-276G. LinkedInFacebookTwitterEmail this Story
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