JEDEC Association News

JEDEC publishes JESD8-29: 0.6 V Low Voltage Swing Terminated Logic (LVSTL06)

JEDEC SmartBrief | Jan 17, 2017

JESD8-29 defines power supply voltage range, dc interface, switching parameter and overshoot/undershoot for high speed low voltage swing terminated NMOS driver family digital circuits with 0.6V supply. The specifications in this standard represent a minimum set of interface specifications for low voltage terminated circuits. JESD8-29 is available for free download from the JEDEC website.

Now is the time to join JEDEC for 2017

JEDEC SmartBrief | Jan 16, 2017

As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: From components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's reasonable membership fees allow companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today.

JEDEC publishes JESD31E: General Requirements for Distributors of Commercial and Military Semiconductor Devices

JEDEC SmartBrief | Dec 30, 2016

This standard identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this document are only applicable to products for which ownership remains with the Distributor or Manufacturer. JESD31E is available for free download from the JEDEC website.

JEDEC publishes JEP174: Understanding Electrical Overstress -- EOS

JEDEC SmartBrief | Dec 29, 2016

This white paper introduces a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. JEP174 is available for free download from the JEDEC website.

NAND Flash Interface Interoperability standard updated

JEDEC SmartBrief | Dec 28, 2016

JESD230C: NAND Flash Interface Interoperability was jointly developed by JEDEC and the Open NAND Flash Interface Workgroup (ONFI). This standard will help enable the design of interoperable systems that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices. JESD230C is available for free download from the JEDEC website.

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