JEDEC Association News


Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download

JEDEC SmartBrief | Apr 21, 2017

JEP95 is a compilation of some 3000 pages of outline drawings for microelectronic packages. An annual updating service and complete hard copies are available for purchase in addition to the free downloads available on the JEDEC website. Recent updates include several new Microelectronic Outlines and Design Registrations.


Register now and save: Reliability of Compound Semiconductors (ROCS) Workshop

JEDEC SmartBrief | Apr 20, 2017

Join us for the 32nd Annual ROCS Workshop on May 22 in Palm Springs, Calif., co-located with CS ManTech. Papers presenting the latest results and new developments in all phases of compound semiconductor reliability will be presented. Register now to save $25-$50 over onsite rates!


Preview DDR5 and NVDIMM-P at JEDEC's Server Forum in June

JEDEC SmartBrief | Apr 19, 2017

Register now for early bird registration rates for JEDEC's Server Forum, to be held on June 19 in Santa Clara, Calif. Experts from industry leaders, including major OEMs, will offer a preview into the widely-anticipated DDR5 (Double Data Rate 5) and NVDIMM-P Design standards currently in development. Increasing server performance requirements are driving the need for more advanced technologies and the standardization of next generation memories such as DDR5 and NVDIMM-P will be essential to fulfilling those needs.


JEDEC welcomes new member companies to the Association

JEDEC SmartBrief | Apr 18, 2017

JEDEC is the global leader in developing standards for the microelectronics industry, bringing together thousands of member company volunteers in over 50 technical committees, subcommittees and task groups to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to new member companies Active-Semi. Inc, Annapurna Labs, Magnachip Semiconductor, Q-Tech Corporation, Silergy Corporation and Wolley Inc. Interested in JEDEC membership for your company? Find out more and join today.


JEDEC publishes JESD210A: Avalanche Breakdown Diode (ABD) Transient Voltage Suppressors

JEDEC SmartBrief | Apr 17, 2017

This standard is applicable to avalanche breakdown diodes when used as a surge protector or transient voltage suppressor (TVS). It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. This standard may be applied to other surge-protection components with similar characteristics as the ABD. JESD210A is available for free download from the JEDEC website.


JEDEC publishes JESD82-32: DDR4 Data Buffer Definition (DDR4DB01)

JEDEC SmartBrief | Apr 03, 2017

This standard defines standard specifications for features and functionality, DC and AC interface parameters and test loading for definition of the DDR4 data buffer for driving DQ and DQS nets on DDR4 LRDIMM applications. For more information and free download, visit the JEDEC website.


JEDEC publishes JESD79-4-1, Addendum No. 1 to JESD79-4, 3D Stacked DRAM

JEDEC SmartBrief | Mar 28, 2017

This document defines the 3DS DDR4 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a compliant 8 Gbit through 128 Gbit for x4, x8 3DS DDR4 SDRAM devices. This addendum was created based on the JESD79-4 DDR4 SDRAM specification. Each aspect of the changes for 3DS DDR4 SDRAM operation was considered. For more information and free download, visit the JEDEC website.




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