Most Clicked StoriesMore >


How to design chips with USB 3.1 links

JEDEC SmartBrief | Jan 23, 2015

The USB 3.1 specification presents certain challenges in IC design, writes Tri Nguyen of Synopsys. "The promise for those who work through the challenges is a USB 3.1 link that attains 10 Gbit/s maximum data rates, increases interoperability and reduces integration risk in storage, digital office, and mobile applications," Nguyen writes. EE Times (01/22)


Qualcomm chips help trash cans communicate

JEDEC SmartBrief | Jan 26, 2015

Sources: Samsung to supply A9 processor for iPhone 7

JEDEC SmartBrief | Jan 26, 2015

Silicon Image to be purchased by Lattice in $600M deal

JEDEC SmartBrief | Jan 27, 2015

Experiment yields quantum entanglement with a silicon chip

JEDEC SmartBrief | Jan 27, 2015

Samsung may sub own chips into future Galaxy S phones

JEDEC SmartBrief | Jan 21, 2015

Scientists create GeSn laser that can work with silicon chips

JEDEC SmartBrief | Jan 23, 2015

Broadcom CEO tips top tech trends

JEDEC SmartBrief | Jan 22, 2015

SK Hynix plans $5.3B in capex to overtake Micron in memory chips

JEDEC SmartBrief | Jan 22, 2015

Experts: Multi-patterning lithography presents challenges

JEDEC SmartBrief | Jan 27, 2015


Find JEDEC SmartBrief Issues by Date:



JEDEC News More >


DDR4 design specifications published

JEDEC SmartBrief | Jan 28, 2015

Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products now available for free download

JEDEC SmartBrief | Jan 28, 2015

It's not too late to join JEDEC for 2015!

JEDEC SmartBrief | Jan 27, 2015

JEDEC welcomes new members Adesto Technology and SemiDice to the association

JEDEC SmartBrief | Jan 27, 2015

JEDEC announces the publication of a joint standard for product discontinuance

JEDEC SmartBrief | Jan 16, 2015




Sign up for JEDEC SmartBrief



Designed specifically for the microelectronics industry, JEDEC SmartBrief is a FREE, weekly e-mail newsletter. By providing the latest need-to-know industry news and information, it saves you time and keeps you smart. Sign up today to receive JEDEC SmartBrief. Learn more

Recent Poll view more polls


What do you anticipate as your most-challenging validation issue in the new year?

Chart.