Most Clicked JEDEC SmartBrief Stories


1. Intel, Micron proclaim "revolutionary" memory chips

JEDEC SmartBrief | Jul 29, 2015

Memory chips that run 1,000 times faster than existing NAND flash memory will help power smartphones, tablets and other electronics, Intel and Micro proclaimed Tuesday, calling their "3D Xpoint" the biggest breakthrough in memory technology in more than 25 years. They said the chips will also have more endurance than current models and will store more data. Bloomberg (07/28) Forbes (07/28) The Wall Street Journal (tiered subscription model) (07/28)


2. Qualcomm's CEO: We'll be "actor" in chipmaker moves

JEDEC SmartBrief | Jul 29, 2015

Qualcomm will be "some form of actor" in the inevitable consolidation in the chip industry, CEO Steve Mollenkopf told Bloomberg. "The timing ... is always the debate," he added. Also, Qualcomm said it has invented a way for phones equipped with metal rear cases to be charged wirelessly as long as they support the Rezence standard. The Verge (07/28) Bloomberg (07/28)


3. Freescale heads into NXP merger at its peak, CEO says

JEDEC SmartBrief | Jul 27, 2015

Freescale Semiconductor grew its net sales and operating earnings in the second quarter, compared with a year ago, as it prepares to complete its merger with NXP Semiconductors later this year. "The strong execution on gross margins and disciplined operating expense led us to generate record operating cash flow and record free cash flow in the quarter," Freescale CEO Gregg Lowe told analysts. EE Times (07/24)


4. Fairchild Semi will sell Malaysia plant, lay off 1,000 workers

JEDEC SmartBrief | Jul 27, 2015

Star Publications (Malaysia) (07/27)


5. Analysis: Are Qualcomm's challenges unique to the company?

JEDEC SmartBrief | Jul 24, 2015

Qualcomm faces a number of market challenges as it retrenches, such as losing business to Samsung Electronics and to fabless semiconductor companies in China, Alexander Sword writes. At the same time, ARM Holdings continues to prosper, reporting second-quarter revenue that was 15% higher than a year earlier. Computer Business Review online (U.K.) (07/23)


6. SK Hynix looks to advanced memories for continued profitability

JEDEC SmartBrief | Jul 24, 2015

SK Hynix, after posting an operating profit in the second quarter 27% higher than a year ago, said it would ramp up production of advanced memory chips to bolster such profitability. "To respond to the rapidly changing market condition, we will boost the production of DDR4 and LPDDR4 memory chips to meet expanding demand while reducing the manufacturing of DDR3 products," President Kim Joon-ho told analysts, adding, "We will also expand production of 10-nano triple-level-cell NAND flash memory chips and the second-generation 3D products. We will also speed up development of TLC-based third-generation products to meet the expanding 3D NAND flash market." The Korea Times (Seoul) (07/23)


7. Tsinghua submits $23B bid for Micron, against all odds

JEDEC SmartBrief | Jul 29, 2015

Tsinghua Unigroup has put forward an informal bid to acquire Micron Technology for about $23 billion, offering $21 a share for the memory chip manufacturer. Micron has reportedly turned down the bid, saying such an acquisition by a Chinese company would be opposed by the U.S. government. Electronic Design (07/28)


8. SiGe technology may help scaling for logic chips

JEDEC SmartBrief | Jul 28, 2015

IBM announced this month that it had fabricated test chips with functional transistors and 7-nanometer features using a silicon germanium process, developed in cooperation with GlobalFoundries, Samsung Electronics and the SUNY Polytechnic Institute. SiGe processes could enable semiconductor industry scaling beyond 7nm, Bernard Cole writes. EE Times (07/27)


9. NXP sells CMOS sensor business to ams

JEDEC SmartBrief | Jul 29, 2015

New Electronics (07/28)


10. Analyst sees Micron and Intel forging closer ties

JEDEC SmartBrief | Jul 28, 2015

Micron Technology and Intel may be poised to disclose a closer working relationship in the wake of a rumored takeover bid for Micron by Tsinghua Unigroup of China, according to Mehdi Hosseini of Susquehanna Financial Group. The announcement "could include some element of funding and/or closer collaboration b/w Micron and Intel in scaling Micron’s 3D NAND technology," he writes. Barron's (subscription required) (07/27)




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