Most Clicked JEDEC SmartBrief Stories

1. ISS: Foundries take the lead in 14/16nm chips

JEDEC SmartBrief | Jan 19, 2015

While Samsung Electronics and GlobalFoundries are in the lead to ship ICs with 14/16-nanometer dimensions in 2015, according to speakers at the Industry Strategy Symposium, Taiwan Semiconductor Manufacturing is making progress with its second-generation 16nm process, it was said. "I suspect the foundries may beat us to true foundry products on 14/16nm FinFET," Intel's Mark Bohr said during an ISS panel session. EE Times (01/16)

2. Connected devices inspire frenzy among chip vendors

JEDEC SmartBrief | Jan 20, 2015

Intel and Qualcomm are among a growing list of semiconductor suppliers reaching for the golden ring in the competition to come out on top in the Internet of Things chip market, as evidenced by the International CES exhibition this month. "We're in for fun times because we are in the midst of a land grab," said Alfonso Velosa of Gartner. CNET (01/19)

3. China's changes could put pressure on Qualcomm, Broadcom

JEDEC SmartBrief | Jan 19, 2015

China Mobile has switched from requiring baseband modem chips to support five modes to supporting three modes, giving an advantage to such Chinese suppliers as Leadcore Technology and Spreadtrum Communications over Qualcomm, sources say. Similarly, smartphone manufacturers in China are shifting to 802.11ac and Bluetooth Low Energy connectivity, putting overseas vendors such as Broadcom at a disadvantage. EE Times (01/16)

4. How to design chips with USB 3.1 links

JEDEC SmartBrief | Jan 23, 2015

The USB 3.1 specification presents certain challenges in IC design, writes Tri Nguyen of Synopsys. "The promise for those who work through the challenges is a USB 3.1 link that attains 10 Gbit/s maximum data rates, increases interoperability and reduces integration risk in storage, digital office, and mobile applications," Nguyen writes. EE Times (01/22)

5. Startup teams with ON Semi on audio chip

JEDEC SmartBrief | Jan 19, 2015

AfterMaster, a company partly owned by Justin Timberlake, has collaborated with ON Semiconductor to develop a chip designed to improve the performance of audio devices. "The AfterMaster chip works by processing the audio in real-time and tuning it depending on the characteristics of the device," Josh Constine writes. TechCrunch (01/16)

6. Samsung may sub own chips into future Galaxy S phones

JEDEC SmartBrief | Jan 21, 2015

Samsung Electronics reportedly may substitute its own processors for "a new version of Qualcomm's Snapdragon chip," the 810, in future Galaxy S smartphones because of heat issues with Qualcomm chips. "Samsung may release the next Galaxy S as early as March, and it can't dare to take the risk to use any of the chips in question for its most important model," said Song Myung Sup of HI Investment & Securities. Bloomberg Businessweek (01/21)

7. Broadcom CEO tips top tech trends

JEDEC SmartBrief | Jan 22, 2015

Broadcom CEO Scott McGregor is a fan of the iGrill, a meat thermometer with a Bluetooth radio, and other consumer gadgets that were exhibited at the 2015 International CES. "Two things at the show have struck me. One is that 4K is becoming real," he says in this interview, adding, "The Internet of Things is becoming more real. The number of devices has gone up tremendously in the last year." VentureBeat (01/21)

8. SK Hynix plans $5.3B in capex to overtake Micron in memory chips

JEDEC SmartBrief | Jan 22, 2015

Maeil Business Newspaper (South Korea) (01/22)

9. Microsoft develops light-based wireless charger prototype

JEDEC SmartBrief | Jan 20, 2015

Microsoft researchers in China have produced a ceiling-mounted device prototype that can charge smartphones on a desk wirelessly through a system called AutoCharge, which uses light beams to power the handsets via Bluetooth or a phone's LED. VentureBeat (01/19)

10. Startup unveils energy-efficient chip for wearables

JEDEC SmartBrief | Jan 20, 2015

Ambiq Micro has introduced the Apollo microcontroller, a low-power chip intended for use in wearable electronics. The technology was originally created by researchers at the University of Michigan and developed through work with Taiwan Semiconductor Manufacturing, the foundry that will make the chips. GigaOm (01/19) Electronics Weekly (U.K.) (01/20)

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