Most Clicked JEDEC SmartBrief Stories


1. Intel, Micron tout capabilities of new 3D NAND flash

JEDEC SmartBrief | Mar 27, 2015

Intel and Micron Technology are sampling their new 3D NAND flash memory device, which they say will enable solid-state drives capable of storing 10 terabytes. The 3D NAND memories are based on floating-gate transistor technology and feature vertically stacked memory cells. PCWorld (03/26) V3.co.uk (U.K.) (03/26)


2. USB 3.1 standard is ready for its desktop moment

JEDEC SmartBrief | Mar 26, 2015

The USB 3.1 standard -- which can deliver data at up to 10 gigabits per second, twice the speed of USB 3.0 -- will soon be making its way into desktop computers. MSI's 970A SLI Krait motherboard, which will support the USB 3.1 protocol and work with Advanced Micro Devices processors, was introduced Wednesday and follows the release of Intel-compatible motherboards with USB 3.1 ports from ASRock, Asus and Gigabyte Technology. PCWorld (03/25)


3. Intel touts performance of "Knights Landing" processor

JEDEC SmartBrief | Mar 26, 2015

The Xeon Phi "Knights Landing" processor, which Intel says will be released in the second half of 2015, is tailored for high-performance computing applications and will feature up to 384 gigabytes of native DDR4 memory, deployed through six channels, and as many as 36 PCIe 3.0 lanes. Xeon Phi will have more than 60 x86-architecture processing cores. "It's an enterprise-class, reliable, enterprise-grade processor," Intel's Hugo Saleh said. eWeek (03/25) Forbes (03/25)


4. SK Hynix aims to strengthen NAND flash business

JEDEC SmartBrief | Mar 23, 2015

SK Hynix CEO Park Sung-wook told shareholders Friday that the company will strengthen its capabilities in NAND flash memory devices during 2015, while putting DRAMs with 20-nanometer features into volume production during the second half of the year. "We will remain competitive as the leader in the DRAM sector by mass producing the lower 20-nanometer-class products and will reinforce capabilities in the NAND flash memory segment by boosting technological caliber in the triple-level cell and three-dimensional sectors," he said. Korea Times (Seoul), The (03/20)


5. Toshiba claims to have the densest 3D flash memory

JEDEC SmartBrief | Mar 27, 2015

Toshiba has introduced a 3D NAND flash memory device with 48 layers of two-bit memory cells. It employs a vertical stacking technology called bit cost scaling and will offer 16 gigabytes of data storage on one chip. Toshiba developed the memory chip with SanDisk and began shipping samples on Thursday. Computerworld (03/26)


6. Qorvo targets RF chip opportunity in China

JEDEC SmartBrief | Mar 25, 2015

Qorvo, the chip company created as result of the $1.6 billion merger of TriQuint Semiconductor and RF Micro Devices, sees a wide opportunity for its radio-frequency components in China. The 4G Long-Term Evolution device market in China soared to 100 million units in 2014, with prospects to increase to 300 million to 400 million units by 2017, according to Thomas Diffely of D.A. Davidson. Investor's Business Daily (03/24)


7. Analysis: Samsung, Intel may be pausing IC gear purchases

JEDEC SmartBrief | Mar 23, 2015

Samsung Electronics and Intel are reportedly spending less than expected on semiconductor production equipment, according to analysts, a trend which is affecting the stock prices of Applied Materials, KLA-Tencor, Lam Research and other equipment vendors. Samsung is said to be adjusting its existing fabrication equipment from producing chips with 20-nanometer features to ICs with 14nm features, while Intel this month suspended its 2015 guidance for capital expenditures. Wall Street Journal (tiered subscription model), The (03/22)


8. Metamaterials promise to improve electronics

JEDEC SmartBrief | Mar 24, 2015

Materials that bend waves of light, sound, radio and radar are being developed by a handful of startups, three of which have been spun out of Intellectual Ventures. Echodyne is developing prototype radar antennas with these metamaterials that could be used in self-driving cars, among other applications. New York Times (tiered subscription model), The (03/23)


9. UTAC CEO predicts growth will continue for back-end IC services

JEDEC SmartBrief | Mar 27, 2015

UTAC Holdings CEO John Nelson is sanguine about the prospects for the semiconductor packaging and testing business in this interview, given demand for chips to be used in the Internet of Things and other applications. "I believe that the IoT, wearable device, mobile device and communication markets will continue to grow robustly, which will bring more opportunities for us and other peer companies," he said. DigiTimes (03/27)


10. TI bows a low-power 32-bit, ARM-based microcontroller

JEDEC SmartBrief | Mar 24, 2015

Texas Instruments has introduced the MSP432 line of 32-bit microcontrollers, which are based on the Cortex-M4F architecture from ARM Holdings. TI turned to the Cortex-M4F core to realize a low-power MCU that could succeed the 16-bit MSP430 line of microcontrollers. EE Times (03/24)




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