Germanium-tin alloy eyed as silicon alternative
 
February 6, 2026
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Report: Intel, AMD spotlight CPU supply issues for China
 
INDIA - 2025/05/18: In this photo illustration, an Advanced Micro Devices (AMD) logo is seen displayed on a smartphone and an Intel logo in the background. (Photo Illustration by Avishek Das/SOPA Images/LightRocket via Getty Images)
(SOPA Images/Getty Images)
Intel and Advanced Micro Devices have warned Chinese clients of potential supply shortages of central processing units, and Intel has said deliveries to Beijing could take as long as six months, according to sources who spoke to Reuters. The warnings have led to a 10% increase in server product prices in China, with Intel's fourth- and fifth-generation Xeon CPUs particularly in short supply. The shortages stem from booming demand for AI infrastructure, with Intel struggling to ramp up production amid manufacturing challenges and AMD facing limited capacity at Taiwan Semiconductor Manufacturing Co.
Full Story: Reuters (2/6), MSN (2/6)
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ICs, Memory & More
 
SIA: Industry revenue to hit $1T this year on AI demand
 
BINZHOU, CHINA - JANUARY 28: A robotic hand performs semiconductor chips packaging at Shandong NEM Semiconductor Co., Ltd. on January 28, 2026 in Binzhou, Shandong Province of China. (Photo by Guo Zhihua/VCG via Getty Images)
(Vcg/Getty Images)
Revenue in the semiconductor industry is expected to total $1 trillion this year for the first time, spurred by AI and the proliferation of chips across the economy, according to the Semiconductor Industry Association. The SIA reports that the industry generated $791.7 billion in revenue last year and is expected to see a 26% increase this year, with the market reaching the $1 trillion mark faster than expected.
Full Story: MSN/Bloomberg (2/6)
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Germanium-tin alloy eyed as silicon alternative
Researchers at the University of Edinburgh have developed a semiconductor material by combining germanium and tin, which was previously thought to be impossible. The germanium-tin alloy, created under extreme conditions, is more effective at absorbing and emitting light than silicon, potentially making electronics faster and more energy efficient. The breakthrough could address the limitations of silicon-based semiconductors and support the growth of AI.
Full Story: Digit News (Edinburgh, Scotland) (2/6)
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Lab replaces copper interposers with microLEDs
Electronics Weekly (UK) (2/6)
 
 
Aheesa Digital offers India's 1st RISC-V-based broadband SoC
EE Times (2/5)
 
 
 
 
Sustainability
 
Viewpoint: AI chip design must prioritize energy efficiency
AI chip designers must prioritize energy efficiency from the earliest design phases, as AI's compute demand is rapidly outpacing power infrastructure, writes Godwin Maben. Designers must address power at the architectural stage to yield significant savings and integrate on-chip telemetry and control to help sustain optimal performance throughout a chip's life cycle, Maben adds.
Full Story: EDN (2/5)
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Germany sees resurgence in semiconductor manufacturing
EE Times (2/5)
 
 
 
 
Semiconductors in Action
 
Honda, Mythic collaborate on neuromorphic SoC
Honda has partnered with Mythic to develop a neuromorphic system-on-chip, seeking to tap into Mythic's advanced technology to develop a new neuromorphic system-on-chip for automated driving in software-defined vehicles. Mythic's neuromorphic technology centers on neural processing units designed to mimic brain-like processing for AI tasks.
Full Story: Electronics Weekly (UK) (2/5)
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Infineon debuts gate drivers for SiC tech migration
Infineon Technologies has introduced a series of isolated gate driver ICs with opto-emulator input. The devices are pin-compatible and offer high common-mode transient immunity. The devices, which are designed to support the adoption of silicon carbide power devices, work with silicon metal-oxide-semiconductor field-effect transistors, insulated-gate bipolar transistors and silicon carbide MOSFETs.
Full Story: Electronics Weekly (UK) (2/6), New Electronics (2/6)
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SmartBreak: Question of the Week
 
Look, I'll back whoever came up with Feb. 7 as Eat Ice Cream for Breakfast Day. What's the best-selling flavor of ice cream, according to a survey of data from Instacart?
VoteButter Pecan
VoteChocolate
VoteStrawberry
VoteVanilla
 
 
 
 
JEDEC News
 
See the latest JEDEC published standards here.
 
JEDEC prepares SPHBM4 standard to deliver HBM4-level throughput with reduced pin count
JEDEC is nearing completion of a new standard for Standard Package High Bandwidth Memory (SPHBM4). SPHBM4 devices are similar to the HBM4 devices commonly used in artificial intelligence accelerators, using the same DRAM dies on a new interface base die that can be mounted on standard organic substrates. In contrast, HBM4 is typically mounted on silicon substrates. For access to pre-publication proposals and early insights into active projects such as SPHBM4, consider joining JEDEC as a member company. Discover the benefits of membership and join today.
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