AMD CEO sees immersive computing as the next step | Sources: Micron suit could chill China's memory biz | IC design firms in China post $30 billion revenue
December 11, 2017
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AMD CEO sees immersive computing as the next step
Advanced Micro Devices CEO Lisa Su called for closer collaboration in the semiconductor industry to realize the next generation in computing technology. "The next level of computing power, especially for consumers, is really around immersive computing and the idea that we all have many, many devices connected to us," she said in a keynote address at the IEEE International Electron Devices Meeting in San Francisco.
EE Times (12/8) 
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ICs, Memory & More
Sources: Micron suit could chill China's memory biz
Micron Technology's US lawsuit against United Microelectronics and Fujian Jinhua Integrated Circuit, alleging the theft of DRAM trade secrets and intellectual property, may slow the progress of memory manufacturers in China, industry sources say. Taiwan's Nanya Technology has similarly accused two former employees of stealing confidential information while accepting jobs at a DRAM company in China, which resulted in indictments against those ex-employees.
DigiTimes (12/11) 
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IC design firms in China post $30 billion revenue
Trendforce estimates China's IC design companies will realize total revenues of $30 billion this year, while forecasting 2018 revenues of $36 billion. Leading design houses in China are aiming at artificial intelligence and 5G wireless communications, with less growth seen at firms focusing on low-end and midrange smartphone chips.
Electronics Weekly (UK) (12/8) 
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Chip packagers to get boost from Apple Watch 3
Taiwan-based providers of semiconductor packaging and testing services could likely benefit from increased shipments of the Apple Watch 3 during 2018. Universal Scientific Industrial, part of the Advanced Semiconductor Engineering group, posted November revenue of $482.81 million, a record for the company, filling system-in-package orders for the Apple wearable gadget.
DigiTimes (12/11) 
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Going Green
Researchers aim for more energy-efficient grid
A research team led by MIT is redesigning gallium nitride power converter devices to handle up to 1,200 volts, an improvement that could benefit electric vehicles and other products. The goal is to make the electrical power grid more energy efficient, especially if those power converters can be further improved to deal with 3,300 to 5,000 volts.
Engadget (12/8) 
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Semiconductors in Action
Toshiba sets sampling of new power amplifier
Toshiba has scheduled sampling of its new TCB701FNG power amplifier for January. The device is a four-channel, high-efficiency class-AB linear power amplifier, meant for automotive audio applications.
Electronics Weekly (UK) (12/8) 
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Testing & Standards
Analysis: Testing next-gen chips gets harder
The testing of next-generation microprocessors, microcontrollers and other system-on-a-chip devices is growing more complicated, outstripping the capability of design-for-test software tools to keep up with the complexity of these chips, this analysis notes. Many companies are turning to system-level testing as one answer to ensure these SoCs will work in their target systems.
Semiconductor Engineering (12/11) 
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JEDEC News
JEDEC welcomes new member companies to the Association
JEDEC is the global leader in developing standards for the microelectronics industry, bringing together thousands of member company volunteers in over 100 technical committees and task groups to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to new member companies ABB, Andapt, Chengdu Haiguang, Monolith Semiconductor, Navitas Semiconductor, Power Integrations, and Qromis Inc. Interested in JEDEC membership for your company? Find out more and join today.
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