Toshiba may discuss sale of chip unit with WD | Imagination Technologies goes on the block | Foxconn may invest $10B in US plants
June 23, 2017
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Toshiba may discuss sale of chip unit with WD
Toshiba is considering discussions with Western Digital about the sale of its chip unit, but it does not expect to add the US company, its memory manufacturing partner, to the preferred bidding group of Bain Capital and Japanese investors. Toshiba hopes to sew up the chip-unit sale by its annual shareholder meeting on June 28.
Reuters (6/23) 
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ICs, Memory & More
Imagination Technologies goes on the block
Imagination Technologies has been placed up for sale after losing 70% of its business value when Apple decided to produce its graphics chips in-house. "I would expect the company to be sold either in pieces or at a discount," said Jim McGregor of Tirias Research.
Reuters (6/22),  EE Times (6/22) 
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Foxconn may invest $10B in US plants
Foxconn Technology Group could invest $10 billion or more in creating US manufacturing jobs, beginning with the $7 billion display factory it plans to build in the US, Chairman Terry Gou said. The new factory and its supply chain will likely be located in the Rust Belt of the US, he told shareholders and reporters.
Bloomberg (6/22),  Nikkei Asian Review (Japan) (tiered subscription model) (6/23) 
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Going Green
Metal TSV wafers unveiled by Micralyne, Microplex
Micralyne and Microplex are collaborating to offer custom wafers with metal through-silicon-vias. The two companies, aiming at semiconductor and sensor applications, plan to begin full production next month.
Electronics360 (6/22) 
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Semiconductors in Action
Team crafts an AI chip for smart factories
ROHM Semiconductor is working with the Institute of Microelectronics in Singapore to jointly develop an artificial intelligence chip that will improve predictive maintenance for internet-connected factories. Predictive maintenance helps manufacturers anticipate machinery breakdowns, reducing downtime for repairs.
Asian Scientist (Singapore) (6/23) 
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​Samsung debuts processor for IoT devices
Samsung Electronics has debuted the Exynos i T200 processor, which is developed for internet of things devices. The chip is fabricated with a 28-nanometer high-k metal gate process.
ZDNet (6/22) 
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Testing & Standards
Experts discuss verification, portable stimulus
Seven industry experts discuss how formal verification technology will work with the proposed portable stimulus standard in this roundtable interview. "A big value to formal, if it can be pulled off, is that PS is designed for mortal engineers to be able to code scenarios," said Adnan Hamid of Breker Verification Systems.
Semiconductor Engineering (6/22) 
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JEDEC News
JEDEC welcomes new member companies to the Association
JEDEC is the global leader in developing standards for the microelectronics industry, bringing together thousands of member company volunteers in over 50 technical committees, subcommittees and task groups to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to new member companies AP Memory Technology Corporation, Sarokal Test Systems and SilabTech. Interested in JEDEC membership for your company? Find out more and join today.
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