Everspin CEO explains spin torque MRAM tech | ARM CEO sees IoT chip growth for China | US stance on IP rights concerns Asia
August 18, 2017
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Today's Tech Buzz
Everspin CEO explains spin torque MRAM tech
Phillip LoPresti, president and CEO of Everspin, discusses spin torque magnetoresistive random-access memory technology in this interview. "MRAM is a nonvolatile memory that provides the aspects of a working memory like SRAM and DRAM," he says.
Semiconductor Engineering (8/17) 
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ICs, Memory & More
ARM CEO sees IoT chip growth for China
China's chipmakers have been producing a lot of ARM-based mobile chips, and strong growth is seen for ARM-based internet of things devices in China, ARM CEO Simon Segars says. ARM is increasing its research and development for the deployment of IoT devices under the ownership of SoftBank Group, he adds.
DigiTimes (8/18) 
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US stance on IP rights concerns Asia
The Trump administration's executive order mandating a government investigation into intellectual property theft is chiefly aimed at China, while Korea doesn't have as much of a problem with US chipmakers, this analysis notes. The acquisition of Xcerra, a supplier of semiconductor testing equipment, by a Chinese government-controlled investment fund may be in jeopardy if the US government sees national security issues involved.
BusinessKorea magazine online (8/18) 
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Data: DRAM shortage eases during Q2
DRAMeXchange reports the tight supply conditions for DRAMs lessened during the second quarter, in comparison with the first quarter of 2017. Worldwide DRAM sales grew 16.9% in Q2 to $16.5 billion, the market-research firm estimates, as average selling prices for PC and server DRAMs were up more than 10% from Q1.
EE Times (8/18) 
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Going Green
Team finds cleaner way to separate graphene
University of Illinois at Urbana-Champaign researchers report developing an alternative method for separating a layer of graphene from its substrate without using chemicals that leave behind a residue in the process. This could promote the use of clean graphene in flexible transparent electronics, they say.
Electronics Weekly (UK) (8/17) 
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Semiconductors in Action
Did ST win the NFC socket in the new iPhone?
The introduction of the next-generation iPhone will answer a question: Did STMicroelectronics provide the Apple handset's near-field communication chip, or did the incumbent supplier, NXP Semiconductors, prevail in the design? The pending acquisition of NXP by Qualcomm may have been a factor in Apple's choice of NFC chips, Junko Yoshida writes.
EE Times (8/17) 
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Testing & Standards
Chipmakers worry about parts for their IC gear
Semiconductor manufacturers are concerned about quality issues in process-critical components for their wafer fabrication equipment, as a bad part could affect chip yields, Mark LaPedus writes. Norm Armour of Micron Technology says, "Sub-components have a major impact in facility systems, which in turn affects fab equipment performance."
Semiconductor Engineering (8/17) 
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JESD245B: Byte Addressable Energy Backed Interface available for free download
The purpose of this standard is definition of an energy-backed byte addressable function on a nonvolatile dual in-line memory module (NVDIMM). This standard defines the feature set and commands implemented by the energy-backed byte addressable function on the NVDIMM. Download JESD245B free of charge from the JEDEC website.
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