Intel forms new group for AI efforts | TowerJazz will make silicon photonics chips | Japanese officials will review Toshiba buyers if a foreign entity is involved
March 24, 2017
JEDEC SmartBrief
News for and about the microelectronics industry
Today's Tech Buzz
Intel forms new group for AI efforts
Intel forms new group for AI efforts
(Justin Sullivan/Getty Images)
Intel has established the Artificial Intelligence Products Group, pulling together its AI efforts in one organization, including chips by Movidius and Nervana Systems, companies Intel acquired in 2016. Naveen Rao, the former Nervana CEO, will serve as vice president and general manager of the new group. News Service (3/23) 
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10 Critical Questions Small Manufacturers Should Ask Before Buying a Cloud-based ERP Solution
How do you know if a cloud-based solution suits your business? And more importantly, how do you find the right match? This whitepaper features 10 important questions you should ask to identify the best cloud-based ERP for your company.
Click here to read the white paper.
ICs, Memory & More
TowerJazz will make silicon photonics chips
TowerJazz is offering a silicon photonics process to go with its silicon germanium bipolar complementary metal-oxide-semiconductor process.
EE Times (3/23) 
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Going Green
Team uncovers flaw in quantum dot solar cells
Researchers at Los Alamos National Laboratory report identifying "very fast electron trapping by defect-related states" as the source of energy-conversion inefficiency in quantum dot solar cells, Steve Bush writes. The discovery is expected to improve the 10% efficiency of such cells.
Electronics Weekly (U.K.) (3/23) 
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Semiconductors in Action
Getting chip designs out is getting harder
While the Semiconductor Industry Association forecasts worldwide chip sales will increase 3.3% this year to about $346 billion, there are numerous challenges to designing and producing ICs, Ed Sperling writes. These factors include safety-critical design, scaling problems and industry inertia.
Semiconductor Engineering (3/23) 
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Register online & save: Reliability of Compound Semiconductors (ROCS) Workshop
Register by May 8 to save $25-50 over onsite rates! Join us for the 32nd Annual ROCS Workshop on May 22 in Palm Springs, CA, co-located with CS ManTech. Papers presenting the latest results and new developments in all phases of compound semiconductor reliability will be presented.
Testing & Standards
Panelists discuss portable stimulus standard
The emerging portable stimulus standard was the topic of a panel session at the recent DVCon. "It is [a] privilege to work with the people on the committee, who are incredibly smart and have passion and are doing really good work, but at the same time it is very frustrating," said Dave Brownell of Analog Devices.
Semiconductor Engineering (3/23) 
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Filling the gap between design, manufacturing
Product engineers at Maxim Integrated play several roles in the transition between chip design and fabrication, Martin Rowe writes. Among their duties is testing the "first silicon" from the wafer fab, working with the design engineers.
EDN (3/23) 
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JEDEC publishes JESD82-32: DDR4 Data Buffer Definition (DDR4DB01)
This standard defines standard specifications for features and functionality, DC and AC interface parameters and test loading for definition of the DDR4 data buffer for driving DQ and DQS nets on DDR4 LRDIMM applications. For more information and free download, visit the JEDEC website.
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